公开(公告)号：US20220310694A1

公开(公告)日：2022-09-29

申请号：US17575088

申请日：2022-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiwon Park ,  Hyunsoo Kim ,  Jinsu Park ,  Suyeol Lee ,  Shiyoung Lee ,  Chiyoon Lee

IPC: H01L27/15

Abstract: A light emitting device includes a printed circuit board (PCB) including a connection pad, a base substrate mounted on the PCB and including a pixel region and a pad region, light emitting structures arranged on the pixel region, a barrier rib structure disposed on the pixel region and disposed at a vertical level different from the light emitting structures, the barrier rib structure including barrier ribs connected with each other to define each of pixel spaces, a phosphor layer filling each pixel space, a dam structure surrounding the barrier rib structure, a pad disposed on the pad region and adjacent to at least one side of an outer boundary of the light emitting structures, a bonding wire connecting the connection pad to the pad, and a molding structure covering the pad, the connection pad, the bonding wire, and at least a portion of the dam structure.

公开(公告)号：US12040349B2

公开(公告)日：2024-07-16

申请号：US17575088

申请日：2022-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiwon Park ,  Hyunsoo Kim ,  Jinsu Park ,  Suyeol Lee ,  Shiyoung Lee ,  Chiyoon Lee

IPC: H01L27/15 ,  H01L23/00

CPC classification number: H01L27/156 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/05554 ,  H01L2224/05569 ,  H01L2224/05573 ,  H01L2224/06153 ,  H01L2224/06155 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48228 ,  H01L2924/182

Abstract: A light emitting device includes a printed circuit board (PCB) including a connection pad, a base substrate mounted on the PCB and including a pixel region and a pad region, light emitting structures arranged on the pixel region, a barrier rib structure disposed on the pixel region and disposed at a vertical level different from the light emitting structures, the barrier rib structure including barrier ribs connected with each other to define each of pixel spaces, a phosphor layer filling each pixel space, a dam structure surrounding the barrier rib structure, a pad disposed on the pad region and adjacent to at least one side of an outer boundary of the light emitting structures, a bonding wire connecting the connection pad to the pad, and a molding structure covering the pad, the connection pad, the bonding wire, and at least a portion of the dam structure.