公开(公告)号：US20230256617A1

公开(公告)日：2023-08-17

申请号：US18058839

申请日：2022-11-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYUN JAE KANG ,  Young Wook KIM ,  Seung Gyu KANG ,  Chul-Jun PARK ,  Yong-Jun AHN ,  Sang Kyung LEE ,  Hyun Woo LEE ,  Jeong Hun LIM

IPC: B25J11/00 ,  B25J9/16

CPC classification number: B25J11/0095 ,  B25J9/1697

Abstract: A loader device includes a frame, a first opening formed in a first side surface of the frame, a second opening formed on a second side surface of the frame, a cavity that connects the first opening and the second opening, a transport unit in the cavity, a first sensor that senses a presence or absence of a first substrate carrier, a second sensor that senses access of a person, and a controller that receives a first sensor signal from the first sensor and receives a second sensor signal from the second sensor. In response to the first sensor signal, the controller controls the transport unit to not transfer a second substrate carrier to the first opening, controls the transport unit to pick up the first substrate carrier from the first opening, and interrupts operation of the transport unit in response to the second sensor signal.

公开(公告)号：US20220307877A1

公开(公告)日：2022-09-29

申请号：US17504212

申请日：2021-10-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanga BANG ,  Geunhyung KIM ,  Sangmin KIM ,  Gi-Nam PARK ,  Chul-Jun PARK ,  Yong-Jun AHN ,  JongJin AHN ,  Min Kyun LEE ,  Sangkyung LEE ,  Kyubum CHO

IPC: G01F1/42 ,  G01F1/37

Abstract: A measurement carrier includes a housing having an internal space, and a flow-rate measuring device located within the internal space. A bottom surface of the housing includes a first inflow hole, a second inflow hole, and an outflow hole, which provide fluid communication between the internal space and an outer space. The flow-rate measuring device may include a first flow-rate measuring sensor in fluid communication with the first inflow hole, and a second flow-rate measuring sensor in fluid communication with the second inflow hole.

公开(公告)号：US20230326777A1

公开(公告)日：2023-10-12

申请号：US17972187

申请日：2022-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngwook KIM ,  Hyunjae KANG ,  Sangmin KIM ,  Chul-Jun PARK ,  Yong-Jun AHN ,  Sangkyung LEE ,  Hyunwoo LEE ,  Junhyuk CHANG

IPC: H01L21/677 ,  B65G47/91

CPC classification number: H01L21/67733 ,  H01L21/67724 ,  H01L21/67727 ,  H01L21/67712 ,  B65G47/91

Abstract: Disclosed are semiconductor carrier storage systems, semiconductor fabrication systems including the same, and/or semiconductor fabrication methods using the same. The semiconductor carrier storage system comprises storage ports each of which accommodates a semiconductor carrier, a shuttle rail that extends in a horizontal direction on a side of the storage ports, an internal carrier shuttle that moves along the shuttle rail and transfers a semiconductor carrier to each of the storage ports, and an upper transport that receives the semiconductor carrier from an overhead hoist transport (OHT). The internal carrier shuttle includes a shuttle body coupled to the shuttle rail, a transfer wheel that connects the shuttle body to the shuttle rail, a gripper that holds the semiconductor carrier, and a hoist that vertically extends between the shuttle body and the gripper and drives the gripper to vertically move.

公开(公告)号：US20200176293A1

公开(公告)日：2020-06-04

申请号：US16529082

申请日：2019-08-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangkyung LEE ,  Yong-Jun AHN ,  Taijo JEON ,  Kyubum CHO ,  Jongsam KIM ,  Gi-Nam PARK ,  Chul-Jun PARK ,  Junyong LEE

IPC: H01L21/673 ,  B05B1/30 ,  H01L21/67

Abstract: A semiconductor wafer storage system includes a container that provides a space in which a semiconductor wafer is to be stored, a fluid supply that provides a fluid to the container, a connection part that receives the fluid from the fluid supply and transfers the fluid to the container, and a nozzle part that connects the connection part to the container. The container may include a coupling plate to which the nozzle part is coupled, and the nozzle part may include a first nozzle and a second nozzle.