DISCRETE DECOUPLING CAPACITOR AND INTEGRATED CIRCUIT CHIP PACKAGE INCLUDING SAME

    公开(公告)号:US20210118618A1

    公开(公告)日:2021-04-22

    申请号:US16850041

    申请日:2020-04-16

    Abstract: A decoupling capacitor includes a first insulating layer extending in a horizontal direction, a storage plate arranged on the first insulating layer, a top plate facing the storage plate, a second insulating layer interposed between the storage plate and the top plate and having a plurality of through holes, a capacitor block including a plurality of capacitor structures in the plurality of through holes, a wiring structure covering the top plate, a first conductive pad arranged on the wiring structure and configured to be electrically connected to the storage plate through a first conductive path of the wiring structure, and a second conductive pad spaced apart from the first conductive pad in the horizontal direction in the same plane as the first conductive pad and configured to be electrically connected to the top plate through a second conductive path of the wiring structure.

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