公开(公告)号：US20230020305A1

公开(公告)日：2023-01-19

申请号：US17736229

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hwanyeol PARK ,  Kyung Nam KANG ,  Jeong Hoon NAM ,  Se Jin KYUNG ,  Dae Wee KONG ,  Tae-Min KIM

IPC: H01L21/67 ,  C23C16/30 ,  C22C21/00

Abstract: An apparatus for manufacturing a semiconductor device and a method of manufacturing the apparatus, the apparatus including a heater configured to heat a target, and a coating layer, the coating layer including a ternary material of transition metal(M)-aluminum(Al)-nitrogen(N) represented by the following Chemical Formula:
[Chemical Formula] MxAl1−xNy, wherein x and y satisfy the following relations: 0

公开(公告)号：US20240278166A1

公开(公告)日：2024-08-22

申请号：US18434923

申请日：2024-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Song Yi BAEK ,  Jae Hyun KIM ,  Hwan Soo HEO ,  Dae Wee KONG ,  Sang Ho ROH

IPC: B01D53/00 ,  B01D53/34 ,  B01D53/46 ,  B01D53/76

CPC classification number: B01D53/007 ,  B01D53/346 ,  B01D53/46 ,  B01D53/76 ,  B01D2251/102 ,  B01D2258/0216 ,  B01D2259/10 ,  B01D2259/804

Abstract: A carbon byproduct removal module includes: a vaporizer configured to produce vapor including oxygen atoms; a carrier gas supplier connected to the vaporizer and configured to supply carrier gas to the vaporizer, wherein the carrier gas carries the vapor to a UV-ray irradiator; and the UV-ray irradiator configured to emit ultraviolet rays to the vapor, wherein a first end of the UV-ray irradiator is connected to a first end of the vaporizer, wherein a second end of the UV-ray irradiator is attached to an exhaust module connected to a chamber in which a semiconductor manufacturing process is performed.

公开(公告)号：US20200149642A1

公开(公告)日：2020-05-14

申请号：US16544513

申请日：2019-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae Wee KONG ,  Se Jin KYUNG ,  Chul Hwan CHOI

IPC: F16K11/10 ,  F15D1/02

Abstract: A valve apparatus includes a valve block with a main flow path, a first valve installed on the valve block and connected to the main flow path so that when the first valve turns on, a first fluid is supplied from the main flow path to a process chamber via the first valve, and a second valve installed on the valve block and connected to the main flow path so that when the first valve turns off and the second valve turns on, a second fluid is supplied from the main flow path to a waste gas treatment system via the second valve. The main flow path is disposed parallel to a central axis passing through a center of the valve block and two opposing surfaces of the valve block perpendicularly thereto. The main flow path is disposed to be offset from the central axis toward the first valve.