公开(公告)号：US20250120009A1

公开(公告)日：2025-04-10

申请号：US18825308

申请日：2024-09-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongwoo KIM ,  Seyeong SEOK ,  Daseul LEE ,  Jonghyeon CHANG

IPC: H05K1/02 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18

Abstract: A semiconductor package includes a base substrate including a lower surface; a semiconductor chip on the base substrate; and a plurality of connection bumps on the lower surface of the base substrate, wherein the plurality of connection bumps includes a first group including connection bumps arranged on the lower surface in a first direction, and a second group including connection bumps arranged on the lower surface in a second direction, the second direction having a first angle with respect to the first direction, the connection bumps of the first group are offset from each other in the first direction, and the connection bumps of the second group are offset from each other in the second direction.