公开(公告)号：US12254621B2

公开(公告)日：2025-03-18

申请号：US17856130

申请日：2022-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Do-Nyun Kim ,  Min-Cheol Kang ,  Kihyun Kim ,  Jaehoon Kim ,  Jaekyung Lim

IPC: G06K9/00 ,  G01N21/95 ,  G06T7/00 ,  H01L21/66

Abstract: Disclosed is an operating method of an electronic device for manufacture of a semiconductor device. The method includes receiving, at the electronic device, a computer-aided design (CAD) image for a lithography process of the semiconductor device, and generating, at the electronic device, a first scanning electron microscope (SEM) image and a first segment (SEG) image from the CAD image by using a machine learning-based module, and the first SEG image includes information about a location of a defect.

公开(公告)号：US12118708B2

公开(公告)日：2024-10-15

申请号：US17465179

申请日：2021-09-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-Cheol Kang ,  Do-Nyun Kim ,  Jaehoon Kim ,  Woojoo Sim

IPC: G06T7/00 ,  G06N3/045

CPC classification number: G06T7/0006 ,  G06T7/97 ,  G06T2207/10061 ,  G06T2207/20081 ,  G06T2207/20221 ,  G06T2207/30148

Abstract: Disclosed is a wafer defect inference system, which includes a test equipment that receives a first image obtained by imaging circuit patterns formed on a semiconductor wafer by using a scanning electron microscope and a second image obtained by imaging a layout image of a mask for implementing the circuit pattern on the semiconductor wafer and combines the first image and the second image to generate a combination image, and at least one computing device that is capable of communicating with the test equipment and infers a defect associated with the circuit pattern formed on the semiconductor wafer. The computing device receives the combination image, performs machine learning for inferring the defect based on the combination image, and generates an output image including information about the defect based on the machine learning.