公开(公告)号：US20230191547A1

公开(公告)日：2023-06-22

申请号：US17940265

申请日：2022-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongdu KIM ,  Sunghyup KIM ,  Hyeonjin KIM ,  Jonggu LEE ,  Dongkyeng HAN

IPC: B23Q3/15 ,  H01L21/683

CPC classification number: B23Q3/15 ,  H01L21/6833

Abstract: An apparatus includes a chuck having an upper surface configured to support a substrate; a fixing unit configured to generate chucking force to fix the substrate to the chuck in a first perpendicular direction and applying the chucking force to the substrate; and a controller configured to divide the chuck into a plurality of zones on a plane perpendicular to the first direction, based on reference overlay distribution corresponding to a degree of overlay deterioration when the substrate is fixed to the upper surface of the chuck, and individually control respective magnitudes of the chucking force applied to each of the plurality of zones. The controller is configured to reduce a magnitude of chucking force applied to a zone including a region having a high degree of overlay deterioration, among the plurality of zones, in the reference overlay distribution.