公开(公告)号：US20250095305A1

公开(公告)日：2025-03-20

申请号：US18962983

申请日：2024-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyeonjin KIM ,  Haemi Yoon ,  Hyunwoo KIM ,  Minji CHO

IPC: G06T19/00 ,  G06F3/01

Abstract: A wearable device includes: a display; and at least one processor, wherein the at least one processor is configured to: receive an input indicating selection of a first external electronic device and a second external electronic device among a plurality of external electronic devices viewable through the display; based on the input, identify third external electronic devices in a category including both the first external electronic device and the second external electronic device, and identify the first external electronic device and the second external electronic device along with the third external electronic devices; display a first visual object and a second visual object respectively indicating that the first external electronic device and the second external electronic device are selected; and display at least one third visual object guiding selection of at least one fourth external electronic device among the third external electronic devices.

公开(公告)号：US20250107190A1

公开(公告)日：2025-03-27

申请号：US18652010

申请日：2024-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonggu LEE ,  Hyeonjin KIM ,  Kyungwon KANG ,  Hyunjae KANG ,  Youngha KIM ,  Jeonggil KIM ,  Jinman KIM ,  Sunghyup KIM ,  Sanghoon LEE

IPC: H01L29/04 ,  H01L23/00 ,  H01L23/498

Abstract: A semiconductor device may include a first semiconductor structure including a first device layer on an upper surface of a first substrate structure, the first device layer including a first region of the semiconductor device; and a second semiconductor structure including a second device layer on a lower surface of a second substrate structure, the second device layer connected to the first device layer and including a second region of the semiconductor device. The first substrate structure may include a first wafer and a second wafer on the first wafer. The second wafer may be in contact with the first device layer. The second substrate structure may include a third wafer and a fourth wafer on a lower surface of the third wafer. The fourth wafer may be in contact with the second device layer. An upper surface of the second wafer may be a (100) crystal plane.

公开(公告)号：US20230370328A1

公开(公告)日：2023-11-16

申请号：US18180279

申请日：2023-03-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Namjin KIM ,  Sungmi PARK ,  Sijae KIM ,  Minkyung JO ,  Hyeonjin KIM ,  Hansoo JUNG

IPC: H04L41/0663 ,  G06F9/451 ,  H04L9/40 ,  H04L41/0681

CPC classification number: H04L41/0663 ,  G06F9/453 ,  H04L63/083 ,  H04L41/0681

Abstract: An electronic device is provided. The electronic device includes a communication circuit and at least one processor. At least one processor is configured to receive device information of an external electronic device from a server, display a guide screen for guiding a communication connection with the external electronic device, based on the device information, establish the communication connection with the external electronic device through the communication circuit, based on a user input on the guide screen, receive connection information comprising an error code related to an offline state of the external electronic device and device log data from the external electronic device through the communication connection, transmit a recovery command to the external electronic device through the communication connection, based on the error code and the device log data, and receive a message indicating that the external electronic device is connected to the server from the server.

公开(公告)号：US20240377893A1

公开(公告)日：2024-11-14

申请号：US18441367

申请日：2024-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haemi YOON ,  Hyeonjin KIM ,  Minji CHO

IPC: G06F3/01 ,  G02B27/01 ,  G06F3/04845 ,  G06T19/20

Abstract: According to an embodiment, at least one processor, comprising processing circuitry, of a wearable device, individually and/or collectively, is configured to: control a display to display, based on identifying the body part in a specified posture for moving the virtual object, the virtual object moved along a path of the body part moved in a FoV of a camera; control the display to display, based on identifying the body part moved outside of the FoV through a first position of an edge of the FoV, a virtual object in a second position within the virtual space corresponding to the first position; and based on displaying the virtual object in the second position, control the display to display, based on identifying the body part in the preset posture moved inside of the FoV, the virtual object moved from the second position and moved along a path of the body part within the FoV.

公开(公告)号：US20230207369A1

公开(公告)日：2023-06-29

申请号：US17893659

申请日：2022-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonggu LEE ,  Sunghyup KIM ,  Jeongdu KIM ,  Hyeonjin KIM ,  Junghwan KIM

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/68742 ,  H01L21/6875

Abstract: A wafer chuck table includes a center plate having a plurality of first protrusions each having an upper end at least partially defining a first reference plane, segmented plates arranged around the center plate and having a plurality of second protrusions, each having an upper end at least partially defining a second reference plane such that the segmented plates have separate, respective pluralities of second protrusions at least partially defining separate, respective second reference planes, and driving units configured to adjust an inclination angle of the segmented plates with respect to the center plate so that the first reference plane and the separate, respective second reference planes are coplanar.

公开(公告)号：US20230191547A1

公开(公告)日：2023-06-22

申请号：US17940265

申请日：2022-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongdu KIM ,  Sunghyup KIM ,  Hyeonjin KIM ,  Jonggu LEE ,  Dongkyeng HAN

IPC: B23Q3/15 ,  H01L21/683

CPC classification number: B23Q3/15 ,  H01L21/6833

Abstract: An apparatus includes a chuck having an upper surface configured to support a substrate; a fixing unit configured to generate chucking force to fix the substrate to the chuck in a first perpendicular direction and applying the chucking force to the substrate; and a controller configured to divide the chuck into a plurality of zones on a plane perpendicular to the first direction, based on reference overlay distribution corresponding to a degree of overlay deterioration when the substrate is fixed to the upper surface of the chuck, and individually control respective magnitudes of the chucking force applied to each of the plurality of zones. The controller is configured to reduce a magnitude of chucking force applied to a zone including a region having a high degree of overlay deterioration, among the plurality of zones, in the reference overlay distribution.