公开(公告)号：US20250107190A1

公开(公告)日：2025-03-27

申请号：US18652010

申请日：2024-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonggu LEE ,  Hyeonjin KIM ,  Kyungwon KANG ,  Hyunjae KANG ,  Youngha KIM ,  Jeonggil KIM ,  Jinman KIM ,  Sunghyup KIM ,  Sanghoon LEE

IPC: H01L29/04 ,  H01L23/00 ,  H01L23/498

Abstract: A semiconductor device may include a first semiconductor structure including a first device layer on an upper surface of a first substrate structure, the first device layer including a first region of the semiconductor device; and a second semiconductor structure including a second device layer on a lower surface of a second substrate structure, the second device layer connected to the first device layer and including a second region of the semiconductor device. The first substrate structure may include a first wafer and a second wafer on the first wafer. The second wafer may be in contact with the first device layer. The second substrate structure may include a third wafer and a fourth wafer on a lower surface of the third wafer. The fourth wafer may be in contact with the second device layer. An upper surface of the second wafer may be a (100) crystal plane.

公开(公告)号：US20210098415A1

公开(公告)日：2021-04-01

申请号：US16837025

申请日：2020-04-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggu LEE ,  Sunghyup KIM ,  Byungjo KIM ,  Sanghoon LEE ,  Sukwon LEE ,  Sebin CHOI

IPC: H01L23/00 ,  B29C65/30 ,  B29C65/00

Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

公开(公告)号：US20230238351A1

公开(公告)日：2023-07-27

申请号：US18128449

申请日：2023-03-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggu LEE ,  Sunghyup KIM ,  Byungjo KIM ,  Sanghoon LEE ,  Sukwon LEE ,  Sebin CHOI

IPC: H01L23/00 ,  B29C65/30 ,  B29C65/00

CPC classification number: H01L24/75 ,  B29C65/30 ,  B29C66/8185 ,  H01L2224/75502 ,  H01L2224/75745 ,  H01L2224/75252 ,  H01L2224/75984

Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

公开(公告)号：US20230207369A1

公开(公告)日：2023-06-29

申请号：US17893659

申请日：2022-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonggu LEE ,  Sunghyup KIM ,  Jeongdu KIM ,  Hyeonjin KIM ,  Junghwan KIM

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/68742 ,  H01L21/6875

Abstract: A wafer chuck table includes a center plate having a plurality of first protrusions each having an upper end at least partially defining a first reference plane, segmented plates arranged around the center plate and having a plurality of second protrusions, each having an upper end at least partially defining a second reference plane such that the segmented plates have separate, respective pluralities of second protrusions at least partially defining separate, respective second reference planes, and driving units configured to adjust an inclination angle of the segmented plates with respect to the center plate so that the first reference plane and the separate, respective second reference planes are coplanar.

公开(公告)号：US20230191547A1

公开(公告)日：2023-06-22

申请号：US17940265

申请日：2022-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongdu KIM ,  Sunghyup KIM ,  Hyeonjin KIM ,  Jonggu LEE ,  Dongkyeng HAN

IPC: B23Q3/15 ,  H01L21/683

CPC classification number: B23Q3/15 ,  H01L21/6833

Abstract: An apparatus includes a chuck having an upper surface configured to support a substrate; a fixing unit configured to generate chucking force to fix the substrate to the chuck in a first perpendicular direction and applying the chucking force to the substrate; and a controller configured to divide the chuck into a plurality of zones on a plane perpendicular to the first direction, based on reference overlay distribution corresponding to a degree of overlay deterioration when the substrate is fixed to the upper surface of the chuck, and individually control respective magnitudes of the chucking force applied to each of the plurality of zones. The controller is configured to reduce a magnitude of chucking force applied to a zone including a region having a high degree of overlay deterioration, among the plurality of zones, in the reference overlay distribution.