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公开(公告)号：US20230170601A1
公开(公告)日：2023-06-01
申请号：US17886808
申请日：2022-08-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dooseok CHOI , Young Min KIM , Min Young YOON , Young Ki LEE
CPC classification number: H01Q1/2283 , H01Q9/0414 , H01Q21/065
Abstract: An electronic device includes a Radio Frequency Integrated Circuit (RFIC) chip, a first antenna module including a plurality of feed points electrically connected to the RFIC chip through a first feed line, and a second antenna module apart from the first antenna module. The second antenna module includes a plurality of feed points electrically connected to the RFIC chip through a second feed line, and a number of the plurality of feed points of the first antenna module is different from a number of the plurality of feed points of the second antenna module.
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公开(公告)号：US20190214703A1
公开(公告)日：2019-07-11
申请号：US16181543
申请日：2018-11-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dooseok CHOI , Thomas Byunghak CHO , Seung-chan HEO
Abstract: A radio frequency (RF) device may include a radio frequency integrated circuit (RFIC) chip and an antenna module on an upper surface of the RFIC chip. The antenna module may include a first patch parallel to the RFIC chip and having an upper surface configured to emit radiation in a vertical direction opposite the first patch from the RFIC chip, a ground plate parallel to the first patch, and between the first patch and the RFIC chip, and a first plurality of feed lines connected to a lower surface of the first patch and configured to supply at least one first differential signal to the first patch from the RFIC chip.
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公开(公告)号：US20240072446A1
公开(公告)日：2024-02-29
申请号：US18387276
申请日：2023-11-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki LEE , Sunwoo LEE , Dooseok CHOI , Seungchan HEO
CPC classification number: H01Q9/045 , H01Q1/38 , H01Q9/0414
Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.
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公开(公告)号：US20220302592A1
公开(公告)日：2022-09-22
申请号：US17833378
申请日：2022-06-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki LEE , Sunwoo LEE , Dooseok CHOI , Seungchan HEO
Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.
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公开(公告)号：US20240347931A1
公开(公告)日：2024-10-17
申请号：US18511376
申请日：2023-11-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dooseok CHOI , Kyeol KWON , Youngki LEE , Dongkwon CHOI
CPC classification number: H01Q21/293 , H01Q3/06 , H01Q21/08
Abstract: An electronic device includes: a first housing including a first surface and a second surface connected to the first surface and having an area that is smaller than an area of the first surface; a second housing including a third surface and a fourth surface connected to the third surface and having an area that is smaller than an area of the third surface; a hinge structure connecting the first housing and the second housing to be foldable relative to each other at a folding axis between a folded state of the electronic device and an unfolded state of the electronic device; a first antenna array provided at the first surface; and a second antenna array provided at the fourth surface; and a flexible board connecting the first antenna array and the second antenna array, wherein the first antenna array and the second antenna array are configured to form a third antenna array and to form a fourth antenna array, according to whether the electronic device is in the unfolded state or in the folded state.
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Patent Agency Ranking
公开(公告)号：US20230024260A1
公开(公告)日：2023-01-26
申请号：US17958813
申请日：2022-10-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dooseok CHOI , Youngki LEE , Sunwoo LEE , Thomas Byunghak CHO
IPC: H01Q9/04 , G06K19/077 , H01Q1/22 , H01Q5/28 , H01Q5/40
Abstract: A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.
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公开(公告)号：US20210067191A1
公开(公告)日：2021-03-04
申请号：US16864251
申请日：2020-05-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dooseok CHOI , Young Min KIM , Jei Young LEE , Dae Young YOON , Sun Woo LEE
Abstract: An electronic device including: a modem configured to process a baseband signal; an intermediate frequency (IF) transceiver configured to convert the baseband signal provided from the modem into an IF band signal; and a radio frequency (RF) transceiver configured to convert the IF band signal provided from the IF transceiver into an RF band signal, wherein the RF transceiver includes a power amplifier configured to amplify the RF band signal, and a temperature sensor unit to detect a temperature of the power amplifier, and wherein the modem includes a controller configured to control an input power inputted to the RF transceiver based on the temperature of the power amplifier detected by the temperature sensor unit.
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8.发明公开公开(公告)号：US20240069184A1
公开(公告)日：2024-02-29
申请号：US18223193
申请日：2023-07-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwoo YOO , Hyung Sun LIM , Dooseok CHOI , Joonhoi HUR
Abstract: An electronic device is provided. The electronic device includes: a transceiver configured to transmit or receive a wireless signal; and a processor configured to: control a first detector to detect whether an object is within a first distance range, based on a transmission/reception power ratio of the wireless signal; control a second detector to detect, based on the object not being detected within the first distance range, whether the object is within a second distance range outside the first distance range, based on a chirp pulse, which is obtained by frequency-modulating the wireless signal; and control transmission power of the wireless signal, based on whether the object is detected by the first detector or the second detector.
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公开(公告)号：US20220376406A1
公开(公告)日：2022-11-24
申请号：US17881219
申请日：2022-08-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki LEE , Sunwoo LEE , Dooseok CHOI
Abstract: An antenna device includes an antenna space, a barrier, a signal processing device, and a feed space. The antenna space includes first and second antennas that transmit/receive first and second radio frequency (RF) signals in different bands. The barrier includes a penetration region, is disposed adjacent to the antenna space, and reflects the first and second RF signals. The signal processing device adjacent to the barrier, includes first and second RF circuits that process the RF signals. The feed space includes first and second feed layers and is disposed adjacent to and stacked on the signal processing device, and adjacent to the barrier. A first feed line connecting the first RF circuit to the first antenna passes through the first feed layer and the penetration region, and a second feed line connecting the second RF circuit to the second antenna passes through the second feed layer and the penetration region.
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公开(公告)号：US20210313708A1
公开(公告)日：2021-10-07
申请号：US17038883
申请日：2020-09-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki LEE , Sunwoo LEE , Dooseok CHOI
Abstract: An antenna device includes a first antenna, a second antenna, a barrier, and a signal processing device. The first antenna transceives a first radio frequency (RF) signal in a first communication band, and the second antenna transceives a second RF signal in a second communication band. The first antenna includes a first radiator and a second radiator having a shape symmetrical to a shape of the first radiator. The second antenna includes third and fourth radiators having shape identical to those of the first and second radiators but having a size corresponding to the second communication band. The barrier includes a penetration region, and reflects the first and second RF signals. A center frequency of the second communication band is higher than a center frequency of the first communication band, and the first and second antennas are connected with the signal processing device through the penetration region of the barrier.
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