VERTICAL MEMORY DEVICES
    1.
    发明申请

    公开(公告)号:US20240381643A1

    公开(公告)日:2024-11-14

    申请号:US18616343

    申请日:2024-03-26

    Abstract: A semiconductor device includes a gate electrode structure including gate electrodes spaced apart in a first direction perpendicular to an upper surface of a substrate, each gate electrode extending in a second direction parallel to the upper surface of the substrate, a memory channel structure, and a support pattern array including support patterns spaced apart in the second direction and a third direction crossing the second direction, wherein each support pattern has a shape including three vertices and three sides, and wherein a first vertex of a first support pattern closest to a second support pattern and a first vertex of the second support pattern closest to the first support pattern are not aligned in the third direction but have different positions in the second direction.

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