SEMICONDUCTOR MEMORY DEVICE
    1.
    发明申请

    公开(公告)号:US20210057419A1

    公开(公告)日:2021-02-25

    申请号:US16833919

    申请日:2020-03-30

    IPC分类号: H01L27/108

    摘要: A semiconductor memory device includes a substrate having a cell region and a contact region with a peripheral circuit region, first and second stacks on the cell region, and a first peripheral transistor on the peripheral circuit region. Each of the first and second stacks includes semiconductor patterns stacked, in a vertical direction, on the cell region, bit lines stacked in the vertical direction on the cell region and respectively connected to first ends of the semiconductor patterns, each of the bit lines extending, in a horizontal direction with respect to the upper surface of the substrate, from the cell region to the contact region, and a word line disposed adjacent to the semiconductor patterns and extending in the vertical direction from the cell region of the substrate. The first peripheral transistor is disposed between the bit lines of the first stack and the bit lines of the second stack.

    SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

    公开(公告)号:US20230389289A1

    公开(公告)日:2023-11-30

    申请号:US18171171

    申请日:2023-02-17

    IPC分类号: H10B12/00

    摘要: A semiconductor device includes bit line structures on a substrate. Each bit line structure extends in a second direction, and the bit line structures are spaced apart from each other in a first direction. The semiconductor device further includes semiconductor patterns spaced apart from each other in the second direction on each of the bit line structures, insulating interlayer patterns between neighboring ones of the semiconductor patterns in the first direction, and word lines spaced apart from each other in the second direction on the bit line structures. Each word line extends in the first direction adjacent to the semiconductor patterns. The semiconductor device further includes capacitors disposed on and electrically connected to the semiconductor patterns, respectively. A seam extending in the second direction is formed in each of the insulating interlayer patterns.