公开(公告)号：US10256174B2

公开(公告)日：2019-04-09

申请号：US15400334

申请日：2017-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Na-rae Shin ,  Jun-ho Song ,  Ji-yong Park ,  Kyoung-suk Yang ,  Hee-jung Hwang ,  Young-hun Jung

IPC: H01L23/498 ,  H01L23/00

Abstract: A film type semiconductor package includes a film substrate; a metal pattern extending a first length in a first direction on the film substrate, having a first width in a second direction perpendicular to the first direction the first length being larger than the first width, and includes a plurality of through holes spaced apart from each other in the first direction; a semiconductor chip including a plurality of pads; and a plurality of bumps spaced apart from each other in the first direction, bonded with the metal pattern, and overlapping the plurality of through holes and connected to the pads of the semiconductor chip.

公开(公告)号：US20180005929A1

公开(公告)日：2018-01-04

申请号：US15400334

申请日：2017-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Na-rae Shin ,  Jun-ho Song ,  Ji-yong Park ,  Kyoung-suk Yang ,  Hee-jung Hwang ,  Young-hun Jung

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L23/4985 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/0913 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/1713 ,  H01L2924/00014

Abstract: A film type semiconductor package includes a film substrate; a metal pattern extending a first length in a first direction on the film substrate, having a first width in a second direction perpendicular to the first direction the first length being larger than the first width, and includes a plurality of through holes spaced apart from each other in the first direction; a semiconductor chip including a plurality of pads; and a plurality of bumps spaced apart from each other in the first direction, bonded with the metal pattern, and overlapping the plurality of through holes and connected to the pads of the semiconductor chip.