公开(公告)号：US09979363B2

公开(公告)日：2018-05-22

申请号：US15171080

申请日：2016-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ju-Hyun Ko ,  Yong-joo Song ,  Jun-ho Song ,  Jin-chul Choi ,  Beop-hee Kim

IPC: H03F3/45 ,  G09G3/20 ,  H03F3/30

CPC classification number: H03F3/45273 ,  G09G3/2092 ,  G09G2310/0248 ,  G09G2310/0254 ,  G09G2310/0291 ,  G09G2310/08 ,  G09G2330/021 ,  H03F3/3022 ,  H03F3/45219 ,  H03F3/45475 ,  H03F2203/45112 ,  H03F2203/45726

Abstract: A source driver includes a buffer device including a plurality of buffers corresponding to a plurality of data lines, each of the plurality of buffers respectively including an amplifier configured to amplify an input signal and an output driver configured to output a driving signal to a corresponding data line among the plurality of data lines; and a switch device including a charge sharing switch configured to electrically connect the plurality of data lines to one another during a charge sharing operation, each of the amplifiers including a first current mirror having a reference current path including a first node and an output current path including a second node, and the first node of the reference current path and the second node of the output current path are electrically connected to each other during the charge sharing operation.

公开(公告)号：US10256174B2

公开(公告)日：2019-04-09

申请号：US15400334

申请日：2017-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Na-rae Shin ,  Jun-ho Song ,  Ji-yong Park ,  Kyoung-suk Yang ,  Hee-jung Hwang ,  Young-hun Jung

IPC: H01L23/498 ,  H01L23/00

Abstract: A film type semiconductor package includes a film substrate; a metal pattern extending a first length in a first direction on the film substrate, having a first width in a second direction perpendicular to the first direction the first length being larger than the first width, and includes a plurality of through holes spaced apart from each other in the first direction; a semiconductor chip including a plurality of pads; and a plurality of bumps spaced apart from each other in the first direction, bonded with the metal pattern, and overlapping the plurality of through holes and connected to the pads of the semiconductor chip.

公开(公告)号：US20180005929A1

公开(公告)日：2018-01-04

申请号：US15400334

申请日：2017-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Na-rae Shin ,  Jun-ho Song ,  Ji-yong Park ,  Kyoung-suk Yang ,  Hee-jung Hwang ,  Young-hun Jung

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L23/4985 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/0913 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/1713 ,  H01L2924/00014

Abstract: A film type semiconductor package includes a film substrate; a metal pattern extending a first length in a first direction on the film substrate, having a first width in a second direction perpendicular to the first direction the first length being larger than the first width, and includes a plurality of through holes spaced apart from each other in the first direction; a semiconductor chip including a plurality of pads; and a plurality of bumps spaced apart from each other in the first direction, bonded with the metal pattern, and overlapping the plurality of through holes and connected to the pads of the semiconductor chip.