公开(公告)号：US20200066682A1

公开(公告)日：2020-02-27

申请号：US16408891

申请日：2019-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeseong KIM ,  Kwangjin MOON ,  Hyoju KIM ,  Junhong MIN ,  Hakseung LEE

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L21/768

Abstract: Disclosed are semiconductor packages and methods of manufacturing the same. The semiconductor package comprises a substrate, a first unit structure attached to the substrate, and a second unit structure attached to the first unit structure. Each of the first and second unit structures comprises an adhesive layer, a lower semiconductor chip on the adhesive layer, an upper semiconductor chip on and in contact with the lower semiconductor chip, and a plurality of vias penetrating the upper semiconductor chip and connecting with the lower and upper semiconductor chips.