公开(公告)号：US20220024037A1

公开(公告)日：2022-01-27

申请号：US17309673

申请日：2019-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sohee LEE ,  Junhong MIN ,  Kyungshik ROH ,  Sukjune YOON ,  Minyong CHOI

IPC: B25J9/16 ,  G06T19/00 ,  G06K9/00 ,  B25J13/08 ,  G05B13/02

Abstract: A robot device according to various embodiments comprises a camera, a robot arm, and a control device electrically connected to the camera and the robot arm, wherein the control device can be configured to collect a robot arm control record about a random operation, acquire, from the camera, a camera image in which a working space of the robot arm is photographed, implement an augmented reality model by rendering a virtual object corresponding to an object related to objective work in the camera image, and update a control policy for the objective work by performing image-based policy learning on the basis of the augmented reality model and the control record.

公开(公告)号：US20200066682A1

公开(公告)日：2020-02-27

申请号：US16408891

申请日：2019-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeseong KIM ,  Kwangjin MOON ,  Hyoju KIM ,  Junhong MIN ,  Hakseung LEE

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L21/768

Abstract: Disclosed are semiconductor packages and methods of manufacturing the same. The semiconductor package comprises a substrate, a first unit structure attached to the substrate, and a second unit structure attached to the first unit structure. Each of the first and second unit structures comprises an adhesive layer, a lower semiconductor chip on the adhesive layer, an upper semiconductor chip on and in contact with the lower semiconductor chip, and a plurality of vias penetrating the upper semiconductor chip and connecting with the lower and upper semiconductor chips.