MONITORING SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MONITORING METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE USING THE SAME

    公开(公告)号:US20240272559A1

    公开(公告)日:2024-08-15

    申请号:US18455277

    申请日:2023-08-24

    CPC classification number: G03F7/70591 G03F7/70033 H01L22/12

    Abstract: A monitoring system for manufacturing a semiconductor device comprises a source module, an optical module including a collector collecting and reflecting extreme ultraviolet generated light from the source module, an illumination optical system including a field facet mirror, and a projection optical system transferring the extreme ultraviolet light reflected from a reticle to a substrate. A calculating module calculates a degradation rate of the optical module, and a method comprises respectively generating a reference image profile and an (N)th image profile through the second sensor module by correcting the far field image of the extreme ultraviolet with respect to the intensity of the extreme ultraviolet at a reference time point and an (N)th time point after the reference time point, and calculating the degradation rate of the optical module by using a ratio of the reference image profile and the (N)th image profile by the calculation module.

    DROPLET GENERATOR AND EXTREME ULTRAVIOLET EXPOSURE DEVICE INCLUDING THE SAME

    公开(公告)号:US20210153332A1

    公开(公告)日:2021-05-20

    申请号:US16990059

    申请日:2020-08-11

    Abstract: A droplet generator for extreme ultraviolet (EUV) exposure device includes a nozzle body with an inclined portion, the nozzle body with the inclined portion having a nozzle shape to discharge a target material in a liquid state, a gas supply pipe, at least a portion of the gas supply pipe being in an internal space of the nozzle body and of the inclined portion, and the gas supply pipe to discharge gas toward the target material in the liquid state, a target material supply unit connected to the nozzle body, the target material supply unit including a first valve, a gas supply unit connected to the gas supply pipe, the gas supply unit including a second valve, and a control unit connected to the first and second valves to control a supply amount of the target material and the gas.

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