SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER

    公开(公告)号:US20250098292A1

    公开(公告)日:2025-03-20

    申请号:US18966327

    申请日:2024-12-03

    Abstract: A semiconductor device includes a substrate having a first region and a second region, first active fins that extend in a first direction in the first region, second active fins that extend in the first direction in the second region, a first field insulating layer between the first active fins and that extend in a second direction, a second field insulating layer between the second active fins and extending in the second direction, a gate line that extends in the second direction on the second field insulating layer, the gate line linearly along with the first field insulating layer, a gate isolation layer between the first field insulating layer and the gate line, and gate spacers that extend in the second direction, the gate spacers in contact with both sidewalls of each of the first field insulating layer, the gate line, and the gate isolation layer.

    SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER

    公开(公告)号:US20200051976A1

    公开(公告)日:2020-02-13

    申请号:US16290199

    申请日:2019-03-01

    Abstract: A semiconductor device includes a substrate having a first region and a second region, first active fins that extend in a first direction in the first region, second active fins that extend in the first direction in the second region, a first field insulating layer between the first active fins and that extend in a second direction, a second field insulating layer between the second active fins and extending in the second direction, a gate line that extends in the second direction on the second field insulating layer, the gate line linearly along with the first field insulating layer, a gate isolation layer between the first field insulating layer and the gate line, and gate spacers that extend in the second direction, the gate spacers in contact with both sidewalls of each of the first field insulating layer, the gate line, and the gate isolation layer.

    SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER

    公开(公告)号:US20230053251A1

    公开(公告)日:2023-02-16

    申请号:US17977031

    申请日:2022-10-31

    Abstract: A semiconductor device includes a substrate having a first region and a second region, first active fins that extend in a first direction in the first region, second active fins that extend in the first direction in the second region, a first field insulating layer between the first active fins and that extend in a second direction, a second field insulating layer between the second active fins and extending in the second direction, a gate line that extends in the second direction on the second field insulating layer, the gate line linearly along with the first field insulating layer, a gate isolation layer between the first field insulating layer and the gate line, and gate spacers that extend in the second direction, the gate spacers in contact with both sidewalls of each of the first field insulating layer, the gate line, and the gate isolation layer.

    SEMICONDUCTOR DEVICE HAVING GATE ISOLATION LAYER

    公开(公告)号:US20210013200A1

    公开(公告)日:2021-01-14

    申请号:US17036355

    申请日:2020-09-29

    Abstract: A semiconductor device includes a substrate having a first region and a second region, first active fins that extend in a first direction in the first region, second active fins that extend in the first direction in the second region, a first field insulating layer between the first active fins and that extend in a second direction, a second field insulating layer between the second active fins and extending in the second direction, a gate line that extends in the second direction on the second field insulating layer, the gate line linearly along with the first field insulating layer, a gate isolation layer between the first field insulating layer and the gate line, and gate spacers that extend in the second direction, the gate spacers in contact with both sidewalls of each of the first field insulating layer, the gate line, and the gate isolation layer.

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20200066856A1

    公开(公告)日:2020-02-27

    申请号:US16386475

    申请日:2019-04-17

    Abstract: A semiconductor device and a method of manufacturing a semiconductor device, the semiconductor device including a substrate including an active fin extending in a first direction; a gate structure extending in a second direction to intersect the active fin; a source/drain region on the active fin; a metal silicide layer on the source/drain region; a filling insulating portion on the metal silicide layer, the filling insulating portion having a contact hole connected to a portion of the metal silicide layer; a protective barrier layer between the metal silicide layer and the filing insulating portion; and a contact plug in the contact hole and electrically connected to the portion of the metal silicide layer.

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