公开(公告)号：US20240282763A1

公开(公告)日：2024-08-22

申请号：US18650982

申请日：2024-04-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： In-Wook OH ,  Byungyun KANG ,  Donghyun KIM ,  Hyungjune KIM ,  Jaebong JUNG

IPC: H01L27/02 ,  H01L21/8238 ,  H01L23/48 ,  H01L23/528 ,  H01L27/092 ,  H01L29/06 ,  H01L29/08 ,  H01L29/423 ,  H01L29/78 ,  H01L29/786

CPC classification number: H01L27/0207 ,  H01L21/823814 ,  H01L21/823821 ,  H01L21/823871 ,  H01L23/481 ,  H01L23/5286 ,  H01L27/092 ,  H01L29/0665 ,  H01L29/0847 ,  H01L29/42392 ,  H01L29/7851 ,  H01L29/78618 ,  H01L29/78696

Abstract: Disclosed is a semiconductor device comprising a substrate that includes a cell region and a dummy region, a first metal layer on the substrate and including a dummy line on the dummy region, a power delivery network on a bottom surface of the substrate, and a first through via that penetrates the substrate and extends from the power delivery network toward the dummy line. The first through via is electrically connected to the dummy line. The power delivery network includes a plurality of lower lines and a pad line below the lower lines. The pad line is electrically connected through the lower lines to the first through via.

公开(公告)号：US20220139900A1

公开(公告)日：2022-05-05

申请号：US17329669

申请日：2021-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： In-Wook OH ,  Byungyun KANG ,  Donghyun KIM ,  Hyungjune KIM ,  Jaebong JUNG

IPC: H01L27/02 ,  H01L27/092 ,  H01L23/48 ,  H01L23/528 ,  H01L29/78 ,  H01L29/08 ,  H01L29/06 ,  H01L29/423 ,  H01L29/786 ,  H01L21/8238

Abstract: Disclosed is a semiconductor device comprising a substrate that includes a cell region and a dummy region, a first metal layer on the substrate and including a dummy line on the dummy region, a power delivery network on a bottom surface of the substrate, and a first through via that penetrates the substrate and extends from the power delivery network toward the dummy line. The first through via is electrically connected to the dummy line. The power delivery network includes a plurality of lower lines and a pad line below the lower lines. The pad line is electrically connected through the lower lines to the first through via.