公开(公告)号：US11538268B2

公开(公告)日：2022-12-27

申请号：US17500434

申请日：2021-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun Lim ,  Younghwan Park ,  Kwangjin Lee ,  Inho Choi ,  Hyuntaek Choi

IPC: G06V40/13

Abstract: A fingerprint sensor package includes a package substrate including an upper surface in which a sensing region and a peripheral region surrounding the sensing region are defined, and a lower surface facing the upper surface; a plurality of first sensing patterns located are arranged in the sensing region, are apart from each other in a first direction, and extend in a second direction crossing the first direction; a plurality of second sensing patterns that are arranged in the sensing region, are apart from each other in the second direction, and extend in the first direction; a coating member covering the sensing region; an upper ground pattern in the peripheral region and apart from the coating member to surround the coating member in the first and second directions; and a controller chip on the lower surface of the package substrate; and a plurality of capacitors.

公开(公告)号：US11900709B2

公开(公告)日：2024-02-13

申请号：US17514088

申请日：2021-10-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun Lim ,  Younghwan Park ,  Kwangjin Lee ,  Dongha Lee ,  Hyuntaek Choi

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  G06K9/00 ,  G06V40/12 ,  G06K19/07 ,  G06K19/073 ,  G06K19/077

CPC classification number: G06V40/12 ,  G06K19/0718 ,  G06K19/07354 ,  G06K19/07747 ,  H01L23/3121 ,  H01L2224/16227

Abstract: A fingerprint sensor package includes a first substrate including a core insulating layer; a first bonding pad on the core insulating layer; and an external connection pad between an edge of the second surface of the core insulating layer and the first bonding pad, a second substrate on the core insulating layer, the second substrate including: a plurality of first sensing patterns spaced apart in a first direction and extending in a second direction intersecting with the first direction; a plurality of second sensing patterns spaced apart from each other in the second direction and extending in the first direction; and a second bonding pad, a conductive wire connecting the first bonding pad to the second bonding pad; a controller chip on the second substrate; and a molding layer covering the second substrate and the first bonding pad and spaced apart from the external connection pad.