-
公开(公告)号:US20200381251A1
公开(公告)日:2020-12-03
申请号:US16838089
申请日:2020-04-02
Applicant: Samsung Electronics Co., Ltd.
Inventor: JAEMUN KIM , GYEOM KIM , SEUNG HUN LEE , DAHYE KIM , ILGYOU SHIN , SANGMOON LEE , KYUNGIN CHOI
IPC: H01L21/02 , H01L29/06 , H01L29/423 , H01L29/786 , H01L21/306 , H01L21/762 , H01L29/66
Abstract: A method includes forming an active pattern on a substrate, the active pattern comprising first semiconductor patterns and second semiconductor patterns, which are alternately stacked, forming a capping pattern on a top surface and a sidewall of the active pattern, performing a deposition process on the capping pattern to form an insulating layer, and forming a sacrificial gate pattern intersecting the active pattern on the insulating layer. The capping pattern has a crystalline structure and is in physical contact with sidewalls of the first semiconductor patterns and sidewalls of the second semiconductor patterns.
-
公开(公告)号:US20220278204A1
公开(公告)日:2022-09-01
申请号:US17742985
申请日:2022-05-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: ILGYOU SHIN , MINYI KIM , MYUNG GIL KANG , JINBUM KIM , SEUNG HUN LEE , KEUN HWI CHO
IPC: H01L29/15 , H01L29/78 , H01L29/417 , H01L29/10
Abstract: A semiconductor device includes; a substrate including a first region and a second region, a first active pattern extending upward from the first region, a first superlattice pattern on the first active pattern, a first active fin centrally disposed on the first active pattern, a first gate electrode disposed on the first active fin, and first source/drain patterns disposed on opposing sides of the first active fin and on the first active pattern. The first superlattice pattern includes at least one first semiconductor layer and at least one first blocker-containing layer, and the first blocker-containing layer includes at least one of oxygen, carbon, fluorine and nitrogen.
-
公开(公告)号:US20210367036A1
公开(公告)日:2021-11-25
申请号:US17128153
申请日:2020-12-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: JINBUM KIM , DAHYE KIM , SEOKHOON KIM , JAEMUN KIM , ILGYOU SHIN , Haejun YU , KYUNGIN CHOI , KIHYUN HWANG , SANGMOON LEE , SEUNG HUN LEE , KEUN HWI CHO
IPC: H01L29/08 , H01L29/165 , H01L29/78 , H01L27/092 , H01L29/423 , H01L29/66 , H01L21/8238
Abstract: A semiconductor device includes an active pattern on a substrate, a pair of source/drain patterns on the active pattern, a channel pattern between the pair of source/drain patterns, the channel pattern including semiconductor patterns stacked to be spaced apart from each other, and a gate electrode crossing the channel pattern and extending in a first direction. One of the pair of source/drain patterns includes a first semiconductor layer and a second semiconductor layer thereon. The first semiconductor layer is in contact with a first semiconductor pattern, which is one of the stacked semiconductor patterns. The largest widths of the first semiconductor pattern, the first semiconductor layer, and the second semiconductor layer in the first direction are a first width, a second width, a third width, respectively, and the second width is larger than the first width and smaller than the third width.
-
公开(公告)号:US20220344469A1
公开(公告)日:2022-10-27
申请号:US17862453
申请日:2022-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: JINBUM KIM , DAHYE KIM , SEOKHOON KIM , JAEMUN KIM , ILGYOU SHIN , Haejun YU , KYUNGIN CHOI , KIHYUN HWANG , SANGMOON LEE , SEUNG HUN LEE , KEUN HWI CHO
IPC: H01L29/08 , H01L29/165 , H01L29/78 , H01L21/8238 , H01L29/423 , H01L29/66 , H01L27/092 , H01L29/786
Abstract: A semiconductor device includes an active pattern on a substrate, a pair of source/drain patterns on the active pattern, a channel pattern between the pair of source/drain patterns, the channel pattern including semiconductor patterns stacked to be spaced apart from each other, and a gate electrode crossing the channel pattern and extending in a first direction. One of the pair of source/drain patterns includes a first semiconductor layer and a second semiconductor layer thereon. The first semiconductor layer is in contact with a first semiconductor pattern, which is one of the stacked semiconductor patterns. The largest widths of the first semiconductor pattern, the first semiconductor layer, and the second semiconductor layer in the first direction are a first width, a second width, a third width, respectively, and the second width is larger than the first width and smaller than the third width.
-
公开(公告)号:US20220102217A1
公开(公告)日:2022-03-31
申请号:US17643935
申请日:2021-12-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: JAEMUN KIM , GYEOM KIM , SEUNG HUN LEE , DAHYE KIM , ILGYOU SHIN , SANGMOON LEE , KYUNGIN CHOI
IPC: H01L21/8234 , H01L21/02 , H01L29/06 , H01L29/423 , H01L29/786 , H01L29/66 , H01L21/306 , H01L21/762
Abstract: A method includes forming an active pattern on a substrate, the active pattern comprising first semiconductor patterns and second semiconductor patterns, which are alternately stacked, forming a capping pattern on a top surface and a sidewall of the active pattern, performing a deposition process on the capping pattern to form an insulating layer, and forming a sacrificial gate pattern intersecting the active pattern on the insulating layer. The capping pattern has a crystalline structure and is in physical contact with sidewalls of the first semiconductor patterns and sidewalls of the second semiconductor patterns.
-
公开(公告)号:US20210343841A1
公开(公告)日:2021-11-04
申请号:US17088011
申请日:2020-11-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: ILGYOU SHIN , MINYI KIM , MYUNG GIL KANG , JINBUM KIM , SEUNG HUN LEE , KEUN HWI CHO
IPC: H01L29/15 , H01L29/10 , H01L29/417 , H01L29/78
Abstract: A semiconductor device includes; a substrate including a first region and a second region, a first active pattern extending upward from the first region, a first superlattice pattern on the first active pattern, a first active fin centrally disposed on the first active pattern, a first gate electrode disposed on the first active fin, and first source/drain patterns disposed on opposing sides of the first active fin and on the first active pattern. The first superlattice pattern includes at least one first semiconductor layer and at least one first blocker-containing layer, and the first blocker-containing layer includes at least one of oxygen, carbon, fluorine and nitrogen.
-
-
-
-
-