公开(公告)号：US20230081831A1

公开(公告)日：2023-03-16

申请号：US17863843

申请日：2022-07-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongwan Kim ,  Jeong-Hyun Kim ,  Seung-Hyeok An ,  Saya Lee ,  Yoong Chung ,  Jiho Jeon ,  Yongjun Cho ,  Injun Choi

IPC: F16L59/02 ,  F16L59/14 ,  F16L59/10

Abstract: Insulation structures, insulated piping devices including the same, and methods of fabricating the same are disclosed. The insulation structure includes a first insulation layer on an outer surface of a pipe, a second insulation layer on an outer surface of the first insulation layer that includes a material different from a material of the first insulation layer, and a third insulation layer on an outer surface of the second insulation layer that includes a material different from the material of the second insulation layer. A thickness of the second insulation layer is greater than a thickness of the first insulation layer and a thickness of the third insulation layer. The second insulation layer includes a porous foam.