公开(公告)号：US11538660B2

公开(公告)日：2022-12-27

申请号：US17242019

申请日：2021-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoong Chung ,  Nam Kyun Kim ,  Naohiko Okunishi ,  Kyung-Sun Kim ,  Seung Bo Shim ,  Sang-Ho Lee ,  Kang Min Jeon

IPC: H01J37/32 ,  H01L21/311

Abstract: A plasma processing apparatus includes; a chamber, a lower electrode disposed within the chamber and including a lower surface and an opposing upper surface configured to seat a wafer, an RF rod disposed on the lower surface of the lower electrode and extending in a vertical direction. The RF plate includes a first portion contacting the lower surface of the lower electrode, a second portion protruding from the first portion towards the RF rod, and a third portion extending from the second portion to connect the RF rod. A grounding electrode is spaced apart from the RF plate and at least partially surrounds a side wall of the RF rod and a side wall of the second portion of the RF plate. The grounding electrode includes a first grounding electrode facing each of the side wall of the RF rod and the second portion of the RF plate, and a second grounding electrode at least partially surrounding the first grounding electrode, and configured to horizontally rotate.

公开(公告)号：US20230081831A1

公开(公告)日：2023-03-16

申请号：US17863843

申请日：2022-07-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongwan Kim ,  Jeong-Hyun Kim ,  Seung-Hyeok An ,  Saya Lee ,  Yoong Chung ,  Jiho Jeon ,  Yongjun Cho ,  Injun Choi

IPC: F16L59/02 ,  F16L59/14 ,  F16L59/10

Abstract: Insulation structures, insulated piping devices including the same, and methods of fabricating the same are disclosed. The insulation structure includes a first insulation layer on an outer surface of a pipe, a second insulation layer on an outer surface of the first insulation layer that includes a material different from a material of the first insulation layer, and a third insulation layer on an outer surface of the second insulation layer that includes a material different from the material of the second insulation layer. A thickness of the second insulation layer is greater than a thickness of the first insulation layer and a thickness of the third insulation layer. The second insulation layer includes a porous foam.