STACKED INTEGRATED CIRCUIT (IC) PACKAGE
    1.
    发明公开

    公开(公告)号:US20240079378A1

    公开(公告)日:2024-03-07

    申请号:US18184029

    申请日:2023-03-15

    Abstract: A stacked IC package includes a first die including a first power transmission region, an adapter die stacked on the first die, a second die stacked on the adapter die and including a second power transmission region, and a first power transmission path electrically connected between the second power transmission region and the first power transmission region through the adapter die. The first power transmission path includes a first power transmission part penetrating a portion of the adapter die in a vertical direction from the first power transmission region, a second power transmission part including a connected part in a horizontal direction from the first power transmission part in the adapter die, and a third power transmission part connected to the second power transmission region in the vertical direction from the second power transmission part. A voltage conversion circuit is arranged on the first power transmission path.

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