Abstract:
A stacked IC package includes a first die including a first power transmission region, an adapter die stacked on the first die, a second die stacked on the adapter die and including a second power transmission region, and a first power transmission path electrically connected between the second power transmission region and the first power transmission region through the adapter die. The first power transmission path includes a first power transmission part penetrating a portion of the adapter die in a vertical direction from the first power transmission region, a second power transmission part including a connected part in a horizontal direction from the first power transmission part in the adapter die, and a third power transmission part connected to the second power transmission region in the vertical direction from the second power transmission part. A voltage conversion circuit is arranged on the first power transmission path.
Abstract:
A garbage collection method of a data storage system having storage devices is provided. The method includes determining whether a garbage collection is needed in one of the storage devices, transferring a multicast garbage collection command from one of the storage devices to at least one other storage device in a write group through a multicast operation, and performing the garbage collection in one of the storage devices.
Abstract:
A device and method that implements a multi-stage electrical interconnection network is provided. The electronic device includes a plurality of computing devices and a plurality of switches grouped into a plurality of groups. Switches, of the plurality of switches, in a same group are configured to be fully connected to computing devices in the same group, each of switches of the plurality of switches included in a first group among the plurality of groups is configured to have a ono-to-one connection with any one of switches included in a second group, and a connection between the computing devices in the same group and the switches in the same group and a connection between switches in in the plurality of groups are electrical connections.
Abstract:
An electronic device and method with on-demand accelerator checkpointing are provided. In one general aspect, an electronic device includes a host processor, and an accelerator configured to operate according to instructions transmitted by the host processor to the accelerator, wherein, a memory of the host processor and a memory of the accelerator are respectively checkpointed to a storage at respective different intervals, and in response to a determination that a failure has occurred in the host processor, the memory of the accelerator is checkpointed to the storage.
Abstract:
A device and method that implements a multi-stage electrical interconnection network is provided. The electronic device includes a plurality of computing devices and a plurality of switches grouped into a plurality of groups. Switches, of the plurality of switches, in a same group are configured to be fully connected to computing devices in the same group, each of switches of the plurality of switches included in a first group among the plurality of groups is configured to have a ono-to-one connection with any one of switches included in a second group, and a connection between the computing devices in the same group and the switches in the same group and a connection between switches in in the plurality of groups are electrical connections.
Abstract:
A method and apparatus with cosmic ray fault protection is included. A method includes obtaining cosmic ray information indicating at least one cosmic ray event, determining a soft error mitigation policy based on the cosmic ray information, accessing the soft error mitigation policy by a device, and based on the soft error mitigation policy, performing, by the device, a mitigation action that mitigates for soft errors related to the cosmic ray event.