STACKED INTEGRATED CIRCUIT (IC) PACKAGE
    1.
    发明公开

    公开(公告)号:US20240079378A1

    公开(公告)日:2024-03-07

    申请号:US18184029

    申请日:2023-03-15

    Abstract: A stacked IC package includes a first die including a first power transmission region, an adapter die stacked on the first die, a second die stacked on the adapter die and including a second power transmission region, and a first power transmission path electrically connected between the second power transmission region and the first power transmission region through the adapter die. The first power transmission path includes a first power transmission part penetrating a portion of the adapter die in a vertical direction from the first power transmission region, a second power transmission part including a connected part in a horizontal direction from the first power transmission part in the adapter die, and a third power transmission part connected to the second power transmission region in the vertical direction from the second power transmission part. A voltage conversion circuit is arranged on the first power transmission path.

    DEVICE AND METHOD WITH MULTI-STAGE ELECTRICAL INTERCONNECTION NETWORK

    公开(公告)号:US20230412524A1

    公开(公告)日:2023-12-21

    申请号:US18460901

    申请日:2023-09-05

    CPC classification number: H04L49/1515 H04Q3/52

    Abstract: A device and method that implements a multi-stage electrical interconnection network is provided. The electronic device includes a plurality of computing devices and a plurality of switches grouped into a plurality of groups. Switches, of the plurality of switches, in a same group are configured to be fully connected to computing devices in the same group, each of switches of the plurality of switches included in a first group among the plurality of groups is configured to have a ono-to-one connection with any one of switches included in a second group, and a connection between the computing devices in the same group and the switches in the same group and a connection between switches in in the plurality of groups are electrical connections.

    DEVICE AND METHOD WITH MULTI-STAGE ELECTRICAL INTERCONNECTION NETWORK

    公开(公告)号:US20230254269A1

    公开(公告)日:2023-08-10

    申请号:US17941334

    申请日:2022-09-09

    CPC classification number: H04L49/1515 H04Q3/52

    Abstract: A device and method that implements a multi-stage electrical interconnection network is provided. The electronic device includes a plurality of computing devices and a plurality of switches grouped into a plurality of groups. Switches, of the plurality of switches, in a same group are configured to be fully connected to computing devices in the same group, each of switches of the plurality of switches included in a first group among the plurality of groups is configured to have a ono-to-one connection with any one of switches included in a second group, and a connection between the computing devices in the same group and the switches in the same group and a connection between switches in in the plurality of groups are electrical connections.

Patent Agency Ranking