System and method of inspecting device under test, and method of manufacturing semiconductor device

    公开(公告)号:US10459348B2

    公开(公告)日:2019-10-29

    申请号:US16053192

    申请日:2018-08-02

    IPC分类号: H04N7/18 G01N21/95 G03F7/20

    摘要: Inspection system for a device under test (DUT) includes an image sensor, N image obtaining devices, K switches, M image processing devices, and at least one added image processing device. The image obtaining devices are connected to the image sensor, and each of the N image obtaining devices receives image data of the image of the DUT captured by the image sensor. Each of the K switches is connected to a respective one of the image obtaining devices. Each of the M image processing devices is connected to a respective one of the switches, receives the image data that is output from one of the N image obtaining devices and is distributed by one of the K switches, and generates processed image data in real-time. The added image processing device is connected to one of the switches, receives the image data, and generates additional processed image data in real-time.