公开(公告)号：US20160197020A1

公开(公告)日：2016-07-07

申请号：US14964523

申请日：2015-12-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soyoung LIM ,  JaeMin JUNG ,  Jeong-Kyu HA ,  Donghan KIM

IPC: H01L21/66 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L22/32 ,  G09G5/003 ,  G09G2310/0264 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/66 ,  H01L24/09 ,  H01L24/16 ,  H01L2223/6616 ,  H01L2224/0912 ,  H01L2224/1415 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/73204

Abstract: A semiconductor package may include a first output test pad and a second output test pad disposed on a first surface of an insulating film, and a semiconductor chip disposed between the first output test pad and the second output test pad on a second surface opposing to the first surface of the insulating film.

Abstract translation: 半导体封装可以包括设置在绝缘膜的第一表面上的第一输出测试焊盘和第二输出测试焊盘，以及设置在与第一输出测试焊盘和第二输出测试焊盘相对的第二表面上的第二输出测试焊盘之间的半导体芯片 绝缘膜的第一表面。

公开(公告)号：US20170125314A1

公开(公告)日：2017-05-04

申请号：US15404110

申请日：2017-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soyoung LIM ,  JaeMin JUNG ,  Jeong-Kyu HA ,  Donghan KIM

IPC: H01L21/66 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00

CPC classification number: H01L22/32 ,  G09G5/003 ,  G09G2310/0264 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/66 ,  H01L24/09 ,  H01L24/16 ,  H01L2223/6616 ,  H01L2224/0912 ,  H01L2224/1415 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/73204

Abstract: A semiconductor package may include a first output test pad and a second output test pad disposed on a first surface of an insulating film, and a semiconductor chip disposed between the first output test pad and the second output test pad on a second surface opposing to the first surface of the insulating film.