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公开(公告)号:US10257497B2
公开(公告)日:2019-04-09
申请号:US15353023
申请日:2016-11-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaehyuk Choi , Jinmyoung Kim , Jungwoo Kim
IPC: H04N5/361 , H04N13/254 , H04N13/25 , H04N13/296 , G01S17/89 , G01S7/486 , G01S7/487 , G01S7/497
Abstract: A depth sensor and a 3D camera include a macro pixel that provides an output signal when light is received and a programmable concurrent detector (PCD) circuit that compares an electric signal provided by the macro pixel with a number of concurrence (NC) and determines a necessity of providing the output signal of the macro pixel. In addition, the depth sensor and the 3D camera may include a controller that measures a dark count of the macro pixel, changes the number of concurrence (NC) of the macro pixel, based on the dark count, and controls noise of the macro pixel. In addition, the depth sensor and the 3D camera may control the noise of the macro pixel, based on an external light count which is a noise signal generated due to the external light.
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公开(公告)号:US09784834B2
公开(公告)日:2017-10-10
申请号:US14602936
申请日:2015-01-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaehyuk Choi , Joonah Park , Jungsoon Shin , Du-Sik Park
Abstract: An image sensing apparatus sensing a user input and an operating method of the image sensing apparatus are disclosed, in which the image sensing apparatus may include an optical source operating based on a burst mode including a turn-on cycle and a turn-off cycle, and an image sensor configured to receive a reflected light using a pixel array and output sensing data of a position of an object in a target area in the reflected light.
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公开(公告)号:US12210125B2
公开(公告)日:2025-01-28
申请号:US17136620
申请日:2020-12-29
Inventor: Jungwoo Kim , Hyeongseok Seo , Jaehyuk Choi
IPC: G01S7/48 , G01S7/4863 , G01S7/4865 , G01S17/10 , G01S17/89
Abstract: A light detection and ranging (LiDAR) device may sequentially select each of a plurality of memory cells based on a coarse clock synchronized with a start signal generated when light is transmitted, may supply power to a plurality of memory cells based on a stop signal generated when light is received, and may calculate a time of flight (ToF) of light based on information of the power accumulated in the plurality of memory cells.
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公开(公告)号:US12094140B2
公开(公告)日:2024-09-17
申请号:US17540927
申请日:2021-12-02
Inventor: Jungwoo Kim , Dusik Park , Jonghwan Ko , Jaehyuk Choi
CPC classification number: G06T7/521 , G06T7/593 , G06T2207/10028
Abstract: A depth map generation apparatus includes: a sensor array including a plurality of sensors configured to detect a received light arrival time; a control circuit array; and a processor configured to divide an acquisition time of at least one of the plurality of sensors into a first time window and a second time window; based on a detection result of the at least one sensor in the first time window and the second time window, generate first sub-frame information; based on the first sub-frame information, determine in which one of the first time window and the second time window an object is detected; generate second sub-frame information from the one of the first time window and the second time window in which the object is detected; and provide the first sub-frame information and the second sub-frame information for generation of an image frame.
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5.
公开(公告)号:US11923214B2
公开(公告)日:2024-03-05
申请号:US17337709
申请日:2021-06-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junghyun Cho , Sang-Geun Park , Dongseok Baek , Jaehyuk Choi
CPC classification number: H01L21/67132 , H01L21/67092 , H01L21/67103 , H01L21/67109 , H01L21/67259 , H01L21/67288 , H01L21/6835 , H01L22/12 , H01L23/3121 , H01L23/481 , H01L21/56 , H01L24/13 , H01L24/94 , H01L2221/68327 , H01L2221/6834 , H01L2221/68395 , H01L2224/13023 , H01L2224/13025
Abstract: A semiconductor packaging apparatus and methods of manufacturing semiconductor devices using the same. The semiconductor packaging apparatus includes a process unit, and a controller associated with the process unit. The process unit includes a bonding part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate, a cooling part that cools the bonded substrate, and a detection part in the cooling part and configured to detect a defect of the bonded substrate. The controller is configured to control the process unit using data obtained from the detection part.
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公开(公告)号:US11376469B2
公开(公告)日:2022-07-05
申请号:US16887673
申请日:2020-05-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Wonhee Lee , Jaehyuk Choi
Abstract: Disclosed is an electronic device capable of automatically identifying a workout environment, such as a swimming pool environment or outdoor environment, based on position-associated information of the electronic device and providing workout information per the workout environment.
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公开(公告)号:US10657400B2
公开(公告)日:2020-05-19
申请号:US16397609
申请日:2019-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jungsoon Shin , Namjoon Kim , Joonah Park , Soochul Lim , Jaehyuk Choi , Tae-Sung Jung
Abstract: An authentication method includes projecting a near infrared (NIR) ray using a light emitting diode (LED) of a terminal, receiving a light reflected by a vein of a user using an image sensor of the terminal, verifying whether an image generated using the received light exhibits a vein pattern, in response to the image generated using the received light being verified as exhibiting the vein pattern, generating a vein pattern of the vein based on an image generated using the received light, and in response to the generated vein pattern being determined to match a pre-stored vein pattern, authenticating the user as a registered user corresponding to the pre-stored vein pattern.
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公开(公告)号:US11153491B2
公开(公告)日:2021-10-19
申请号:US16954005
申请日:2018-12-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jaehyuk Choi
Abstract: The electronic device according to an embodiment includes: a camera; a display; a memory storing one or more instructions; and a processor configured to execute the one or more instructions stored in the memory to: determine a size of a wall surface to be photographed to be output to an image display apparatus; control the display to display, on a preview image, a guideline indicating a region corresponding to the size of the wall surface to be photographed, based on a distance between the electronic device and the wall surface; control the camera to capture an image indicating the wall surface, based on the output guideline; and transmit the captured image to the image display apparatus such that the captured image is output to the image display apparatus.
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9.
公开(公告)号:US11062924B2
公开(公告)日:2021-07-13
申请号:US16149771
申请日:2018-10-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junghyun Cho , Sang-Geun Park , Dongseok Baek , Jaehyuk Choi
Abstract: A semiconductor packaging apparatus and methods of manufacturing semiconductor devices using the same. The semiconductor packaging apparatus includes a process unit, and a controller associated with the process unit. The process unit includes a bonding part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate, a cooling part that cools the bonded substrate, and a detection part in the cooling part and configured to detect a defect of the bonded substrate. The controller is configured to control the process unit using data obtained from the detection part.
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公开(公告)号:US10587789B2
公开(公告)日:2020-03-10
申请号:US14723824
申请日:2015-05-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaehyuk Choi , Du-Sik Park , Joonah Park
Abstract: An image sensor for simultaneously obtaining an image and a proximity is provided. The image sensor includes a proximity signal generating circuit configured to generate a proximity signal of a target based on a pixel signal of a pixel array. The proximity signal generating circuit generates the proximity signal based on an average of pixel signals output from a plurality of pixels included in the pixel array.
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