公开(公告)号：US20240145416A1

公开(公告)日：2024-05-02

申请号：US18384250

申请日：2023-10-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonyoung CHOI ,  Minwoo Rhee ,  Sungyoung Yoon ,  Jaehyun Phee ,  Bumki Moon ,  Kyeongbin Lim

IPC: H01L23/00 ,  H01L23/528

CPC classification number: H01L24/03 ,  H01L23/5283 ,  H01L24/05 ,  H01L24/08 ,  H01L2224/03444 ,  H01L2224/05147 ,  H01L2224/05447 ,  H01L2224/08145

Abstract: A substrate bonding method includes: forming first plasma on a bonding surface of a first substrate at atmospheric pressure by using a mixed gas including an inert gas and water vapor, to thereby perform surface activation treatment on the bonding surface of the first substrate; forming second plasma on a bonding surface of a second substrate at atmospheric pressure by using the mixed gas, to thereby perform surface activation treatment on the bonding surface of the second substrate; bonding the bonding surface of the first substrate and the bonding surface of the second substrate to each other; and moving each of the first substrate and the second substrate at a constant speed in a region above a linear reactor in which the first plasma and the second plasma are formed.

公开(公告)号：US11728197B2

公开(公告)日：2023-08-15

申请号：US17218606

申请日：2021-03-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyun Phee ,  Hoechul Kim ,  Seokho Kim ,  Taeyeong Kim ,  Hoonjoo Na

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/681 ,  H01L21/67092 ,  H01L21/6838

Abstract: A wafer bonding apparatus including a first stage having a first surface and being configured to hold a first wafer on the first surface; a second stage having a second surface and being configured to hold a second wafer on the second surface facing the first surface; a first target image sensor on an outer portion of the first stage; a second target image sensor on an outer portion of the second stage; and a target portion on the first or second stage, the target portion having a target plate fixedly installed and spaced apart from the first or second target image sensor by a predetermined distance, wherein, in an alignment measurement of the first and second stages, the first and second stages are movable so that the first and second target image sensors face each other and the target plate is between the first and second target image sensors.