公开(公告)号：US20240071845A1

公开(公告)日：2024-02-29

申请号：US18209286

申请日：2023-06-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaesun KIM ,  Yunseok CHOI ,  Youngbae KIM

IPC: H01L21/66 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L22/32 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/16 ,  H01L25/105 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A semiconductor package includes: a redistribution layer including a plurality of conductive lines; a plurality of conductive vias each connected to at least one of the plurality of conductive lines; and a plurality of lower pads each connected to one of the plurality of conductive vias; a semiconductor chip on the redistribution layer; and a plurality of external connection terminals attached to the plurality of lower pads; and a plurality of electrical paths, wherein each of the plurality of electrical paths includes at least one of the plurality of conductive lines and at least one of the plurality of conductive vias. The plurality of electrical paths is configured for testing the plurality of conductive lines and the plurality of conductive vias and is connected to at least four of the external connection test terminals.

公开(公告)号：US20250087596A1

公开(公告)日：2025-03-13

申请号：US18641782

申请日：2024-04-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaesun KIM

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01Q1/22

Abstract: A semiconductor package may include a lower redistribution structure, conductive posts on an upper surface of the lower redistribution structure, a first semiconductor chip on the upper surface of the lower redistribution structure and separated from a conductive post in a first direction parallel to the upper surface of the lower redistribution structure, a radio frequency chip on the upper surface of the lower redistribution structure and separated from the first semiconductor chip in the first direction, a ground post between the first semiconductor chip and the radio frequency chip and configured to shield against an electromagnetic wave generated from the radio frequency chip, a molding layer covering the upper surface of the lower redistribution structure, and a ground layer in contact with an upper surface of the ground post. The molding layer may surround the conductive posts, first semiconductor chip, radio frequency chip, and ground post.

公开(公告)号：US20240096777A1

公开(公告)日：2024-03-21

申请号：US18323646

申请日：2023-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaesun KIM ,  Sanghyun LEE ,  Yeonho JANG ,  Yunseok CHOI

IPC: H01L23/498 ,  H01L21/66 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L22/12 ,  H01L22/14 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/14511

Abstract: A semiconductor package includes a redistribution structure in which redistribution layers and insulating layers are alternately stacked. A semiconductor chip is electrically connected to the redistribution layers, and bumps are electrically connected to the redistribution layers and arranged on one surface of the redistribution structure. The redistribution layers include pads arranged to face the bumps, and each of the pads includes a first pad portion offset from a center of each of the pads in a first direction, a second pad portion offset from the center of each of the pads in a second direction, and a connection portion connecting the first and second pad portions. The connection portion includes a protruding portion that defines a first recessed region recessed adjacent to the first pad portion and a second recessed region recessed adjacent to the second pad portion.