公开(公告)号：US12085808B2

公开(公告)日：2024-09-10

申请号：US18142355

申请日：2023-05-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin Lee ,  Jaewoo Kim ,  Hyungsuk Kim ,  Hyukjun Jang

IPC: G02F1/13357

CPC classification number: G02F1/133608

Abstract: A display apparatus includes: an optical member; a substrate provided at a rear side of the optical member, the substrate including a through-hole and a circuit pattern on a front surface of the substrate; a metal structure provided at a rear side of the substrate; and a supporter provided on the front surface of the substrate, wherein the supporter includes: a body supporting the optical member, the body being provided on the front surface of the substrate and aligned with the through-hole; a circuit pattern portion provided on the body and electrically connected to the circuit pattern on the front surface of the substrate; and a metal portion extending from a bottom surface of the body into the through-hole in a direction toward the metal structure, the metal portion being electrically connected to the circuit pattern portion and the metal structure.

公开(公告)号：US20240027832A1

公开(公告)日：2024-01-25

申请号：US18142355

申请日：2023-05-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngmin LEE ,  Jaewoo Kim ,  Hyungsuk Kim ,  Hyukjun Jang

IPC: G02F1/13357

CPC classification number: G02F1/133608

Abstract: A display apparatus includes: an optical member; a substrate provided at a rear side of the optical member, the substrate including a through-hole and a circuit pattern on a front surface of the substrate; a metal structure provided at a rear side of the substrate; and a supporter provided on the front surface of the substrate, wherein the supporter includes: a body supporting the optical member, the body being provided on the front surface of the substrate and aligned with the through-hole; a circuit pattern portion provided on the body and electrically connected to the circuit pattern on the front surface of the substrate; and a metal portion extending from a bottom surface of the body into the through-hole in a direction toward the metal structure, the metal portion being electrically connected to the circuit pattern portion and the metal structure.

公开(公告)号：US12001101B2

公开(公告)日：2024-06-04

申请号：US18112270

申请日：2023-02-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin Lee ,  Jaewoo Kim ,  Seungyong Shin ,  Hyukjun Jang

IPC: G02F1/1335 ,  G02F1/13357 ,  H05K1/18

CPC classification number: G02F1/133612 ,  G02F1/133608 ,  H05K1/182 ,  G02F1/133603 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10189

Abstract: A display apparatus includes a display panel, a printed circuit board defining an upper surface, a lower surface opposite the upper surface, and a through-hole, a plurality of light sources mounted on the upper surface of the printed circuit board and configured to emit light to the display panel, and a connector inserted into the through-hole on the upper surface of the printed circuit board. The connector includes a connector body inserted into the through-hole, and a plurality of connector terminals disposed in proximity to the upper surface of the printed circuit board. The connector terminals are configured to electrically connect the connector body to a portion of the printed circuit board, and may in certain embodiments connect a first portion of the printed circuit board on one side of the connector body to a second portion of the printed circuit board on an opposite of the connector body.

公开(公告)号：US12282225B2

公开(公告)日：2025-04-22

申请号：US18643399

申请日：2024-04-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngmin Lee ,  Jaewoo Kim ,  Seungyong Shin ,  Hyukjun Jang

IPC: G02F1/1335 ,  G02F1/13357 ,  H05K1/18

Abstract: A display apparatus includes a display panel, a printed circuit board defining an upper surface, a lower surface opposite the upper surface, and a through-hole, a plurality of light sources mounted on the upper surface of the printed circuit board and configured to emit light to the display panel, and a connector inserted into the through-hole on the upper surface of the printed circuit board. The connector includes a connector body inserted into the through-hole, and a plurality of connector terminals disposed in proximity to the upper surface of the printed circuit board. The connector terminals are configured to electrically connect the connector body to a portion of the printed circuit board, and may in certain embodiments connect a first portion of the printed circuit board on one side of the connector body to a second portion of the printed circuit board on an opposite of the connector body.

公开(公告)号：US12230746B2

公开(公告)日：2025-02-18

申请号：US18195534

申请日：2023-05-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyukjun Jang ,  Sungyeol Kim ,  Jaewoo Kim ,  Taeyeon Kim ,  Junsung Choi

IPC: H01L33/58 ,  G02F1/1335 ,  G02F1/13357 ,  H01L25/13

Abstract: Disclosed herein is a display apparatus. The display apparatus includes: a liquid crystal panel; and a backlight unit configured to emit light to the liquid crystal panel. The backlight unit includes: a substrate extending along a first direction; a light emitting diode provided on the substrate; a refractive cover provided on the light emitting diode to refract light emitted from the light emitting diode; and a lens provided on the substrate and the refractive cover, the lens comprising a bottom surface having a first length in the first direction that is less than a second length in a second direction perpendicular to the first direction.

公开(公告)号：US10319592B2

公开(公告)日：2019-06-11

申请号：US15959506

申请日：2018-04-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaewoo Kim

IPC: H01L21/311 ,  H01L21/768 ,  H01L21/033

Abstract: Methods of fabricating a semiconductor device are provided. The methods may include forming a hard mask film on a lower film and forming first spacers on the hard mask film. The first spacers may define an exposure region of the hard mask film, and the exposure region may include a patterning portion and a non-patterning portion. The methods may also include forming a mold film on the first spacers and forming a blocking pattern in the mold film. The blocking pattern may vertically overlap the non-patterning portion. The methods may further include exposing the first spacers by removing the mold film after forming the blocking pattern.

公开(公告)号：US09966262B2

公开(公告)日：2018-05-08

申请号：US15246092

申请日：2016-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaewoo Kim

IPC: H01L21/033 ,  H01L21/311 ,  H01L21/768

CPC classification number: H01L21/0337 ,  H01L21/31144 ,  H01L21/76816

Abstract: Methods of fabricating a semiconductor device are provided. The methods may include forming a hard mask film on a lower film and forming first spacers on the hard mask film. The first spacers may define an exposure region of the hard mask film, and the exposure region may include a patterning portion and a non-patterning portion. The methods may also include forming a mold film on the first spacers and forming a blocking pattern in the mold film. The blocking pattern may vertically overlap the non-patterning portion. The methods may further include exposing the first spacers by removing the mold film after forming the blocking pattern.