公开(公告)号：US20160370422A1

公开(公告)日：2016-12-22

申请号：US15145182

申请日：2016-05-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taek-Sung Kim ,  Ji Eon Kim ,  SoonYong Hur

IPC: G01R31/28

CPC classification number: G01R31/2889

Abstract: A probing interposer includes a supporting substrate with first and second surfaces facing each other and via patterns penetrating the supporting substrate. Each of the via patterns have a concave portion that is exposed through the first surface and has a shape recessed in a direction from the first surface toward the second surface. The concave portion has a width that is smaller than that of the via pattern, and the width decreases in the direction from the first surface toward the second surface.

Abstract translation: 探测插入件包括支撑基板，其具有彼此面对的第一和第二表面以及穿过支撑基板的图案。 每个通孔图案具有通过第一表面暴露的凹部，并且具有从第一表面朝向第二表面的方向凹陷的形状。 凹部具有比通孔图案的宽度小的宽度，并且宽度在从第一表面朝向第二表面的方向上减小。