公开(公告)号：US20170359492A1

公开(公告)日：2017-12-14

申请号：US15617516

申请日：2017-06-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyu Ik Cho ,  Ji Yong KIM ,  Jae Jung PARK

IPC: H04N3/14 ,  H04N5/341 ,  H04N5/335

Abstract: An image sensor is provided. The image sensor may include an active pixel electrically connected to a column line and configured to provide an output voltage to a pixel node and a bias circuit electrically connected between the pixel node and an earth terminal, and in which a first current flows through a first line electrically connected to the pixel node, wherein the bias circuit includes a first variable capacitor electrically connected to a power supply voltage, and a second variable capacitor electrically connected to the earth terminal, and the magnitude of the first current may be configured to vary based on a ratio of a capacitance of the first variable capacitor to a capacitance of the second variable capacitor. The output voltage may be configured to be adjusted based on the magnitude of the first current.

公开(公告)号：US20240429082A1

公开(公告)日：2024-12-26

申请号：US18703734

申请日：2022-10-05

Applicant: Kyu Ok LEE ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyu Ok LEE ,  Ji Yong KIM

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/68

Abstract: A FOUP comprises: an external server; and a substrate processing device for performing substrate processing and transmitting integrated management data to the external server. The substrate processing device comprises: FOUPs for accommodating a plurality of substrates; load ports to which the FOUPs are detachably coupled; a process chamber in which substrate processing is performed; an EFEM, which is provided between the process chamber and the load ports, and has an end effector for getting, into the process chamber, the substrates accommodated in the FOUPs or putting, into the FOUPs, the substrates for which processing is completed in the process chamber; and a control unit for transmitting, if the FOUPs are loaded in the load ports, moving path data of the end effector to the external server when the end effector enters into or retreats from the FOUPs.

公开(公告)号：US20190165449A1

公开(公告)日：2019-05-30

申请号：US16202596

申请日：2018-11-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hoon KIM ,  Ji Yong KIM ,  Jong In LEE ,  Yeon Jeong KIM ,  Yong Jun AN ,  Hyo Seok NA

IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q21/00 ,  H01Q23/00

Abstract: Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.

公开(公告)号：US20220216589A1

公开(公告)日：2022-07-07

申请号：US17693501

申请日：2022-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hoon KIM ,  Ji Yong KIM ,  Jong In LEE ,  Yeon Jeong KIM ,  Yong Jun AN ,  Hyo Seok NA

IPC: H01Q1/22 ,  H01Q23/00 ,  H01Q21/00 ,  H01Q1/24 ,  H01Q9/04 ,  H01L23/66 ,  H01P5/18 ,  H01Q5/335 ,  H01Q21/06

Abstract: Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.

公开(公告)号：US20240282607A1

公开(公告)日：2024-08-22

申请号：US18200201

申请日：2023-05-22

Applicant: Kyu Ok LEE ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyu Ok LEE ,  Ji Yong KIM

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68

CPC classification number: H01L21/67259 ,  H01L21/67778 ,  H01L21/681

Abstract: The present invention relates to a position determination apparatus for a robot detection laser sensor system in front-opening unified pods (FOUPs), including: an external server; and a wafer processing device for performing processing for wafers and transmitting integration management data to the external server, wherein the wafer processing device may include: the FOUPs configured to accommodate the wafers therein; loadports to which the FOUPs are detachably coupled; processing chambers in which the processing for the wafers are performed; and an equipment front end module (EFEM) disposed between the processing chambers and the loadports and having an end-effector adapted to get the wafers out of the FOUPs into the processing chambers or put the wafers finished in processing in the processing chambers into the FOUPs.

公开(公告)号：US20220115800A1

公开(公告)日：2022-04-14

申请号：US17392763

申请日：2021-08-03

Applicant: SAMSUNG ELECTRONICS CO, LTD.

Inventor： Kyung-Suk KIM ,  Chung Hyun RYU ,  So-Young JUNG ,  Ji Yong KIM ,  Jin Wook SONG

IPC: H01R12/72 ,  H01R13/26 ,  H05K1/11

Abstract: A electronic device including a host connector and memory device is provided. The host connector includes a connector pin, and the memory connector includes a connection terminal electrically connected to the connector pin of the host connector. The connector pin includes a first conductor part including a conductor, a second conductor part including the conductor, the second conductor part being bent from the first conductor part in a direction towards the connection terminal, and a stub including an insulator, the stub being bent from the second conductor part in a direction away from the connection terminal. The connection terminal includes a first region including an insulator, and a second region including a conductor. The second conductor part is electrically connected to the second region, so that the host connector is electrically connected to the memory connector.