公开(公告)号：US20140103517A1

公开(公告)日：2014-04-17

申请号：US14052980

申请日：2013-10-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Kyu PARK ,  Hyeongmun KANG ,  Ji-Han KO

IPC: H01L23/50

CPC classification number: H01L23/50 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

Abstract: A package substrate includes a substrate including a top surface and a bottom surface facing each other, the top surface including a first region where a semiconductor chip is mounted and a second region surrounding the first region, and a dummy post on the second region of the top surface to protrude upward from the top surface.

Abstract translation: 封装基板包括基板，该基板包括彼此面对的顶表面和底表面，所述顶表面包括安装半导体芯片的第一区域和围绕所述第一区域的第二区域，以及位于所述第二区域的第二区域上的虚拟柱 顶面从顶面向上突出。