公开(公告)号：US20180130714A1

公开(公告)日：2018-05-10

申请号：US15609284

申请日：2017-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eokbong KIM ,  Jin sung CHOI ,  Mun Ja KIM ,  Kijung SON

IPC: H01L21/66 ,  H01L21/027 ,  G03F1/62

CPC classification number: H01L22/20 ,  G01F1/86 ,  G03F1/44 ,  G03F1/62 ,  G03F1/86 ,  H01L21/0274 ,  H01L22/12

Abstract: A reticle may be fabricated and inspected. The reticle, which may include thin patterns, may be selectively incorporated into a fabricated semiconductor device based on measurement information generated based on the inspecting. The inspecting may include forming thin patterns on a substrate, forming a first discharge layer on the thin patterns, and directing a first charged particle beam to the substrate, such that the first charged particle beam passes through the first discharge layer. Measurement information may be generated based on the first charged particle beam. The first discharge layer may connect the thin patterns to each other and may be separated from the substrate between the thin patterns.