公开(公告)号：US20240355848A1

公开(公告)日：2024-10-24

申请号：US18490177

申请日：2023-10-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinsu PARK ,  Nosan PARK ,  Jae-Kwan SEO ,  Wonchun YANG ,  Kookki LEE ,  Seul-Young JEONG

IPC: H01L27/146 ,  H04N25/13

CPC classification number: H01L27/14621 ,  H01L27/14627 ,  H01L27/14645 ,  H01L27/14685 ,  H04N25/135

Abstract: A manufacturing method of an image sensor includes inputting a substrate in an equipment, wherein a sensor array and a plurality of pads are on the substrate; forming a plurality of vortex generating patterns at regular intervals between the plurality of pads and the sensor array; and coating a photo resist while rotating the substrate based on operating the equipment.

公开(公告)号：US20230127496A1

公开(公告)日：2023-04-27

申请号：US17974002

申请日：2022-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sukchul PARK ,  Beommo SEONG ,  Sanghoon JUNG ,  Woonbae KIM ,  Jinsu PARK ,  Byounguk YOON

IPC: H05K5/02 ,  H04B1/3818

Abstract: An electronic device includes a circuit board, a socket on the circuit board and electrically connected to the circuit board, and a tray removably insertable into the socket from outside the electronic device, the tray including a body portion, a first protrusion extended from the body portion, and a second protrusion extended from the body and spaced apart from the first protrusion. The socket includes a detection portion which is engageable with the first protrusion of the tray and detects insertion of the tray in the socket, together with the circuit board, and a supporting portion which is engageable with the second protrusion of the tray. The tray which is inserted into the socket disposes the first protrusion contacting the detection portion, and a portion of the tray corresponding to the second protrusion supported by the supporting portion.