公开(公告)号：US20240355848A1

公开(公告)日：2024-10-24

申请号：US18490177

申请日：2023-10-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinsu PARK ,  Nosan PARK ,  Jae-Kwan SEO ,  Wonchun YANG ,  Kookki LEE ,  Seul-Young JEONG

IPC: H01L27/146 ,  H04N25/13

CPC classification number: H01L27/14621 ,  H01L27/14627 ,  H01L27/14645 ,  H01L27/14685 ,  H04N25/135

Abstract: A manufacturing method of an image sensor includes inputting a substrate in an equipment, wherein a sensor array and a plurality of pads are on the substrate; forming a plurality of vortex generating patterns at regular intervals between the plurality of pads and the sensor array; and coating a photo resist while rotating the substrate based on operating the equipment.