公开(公告)号：US20240355848A1

公开(公告)日：2024-10-24

申请号：US18490177

申请日：2023-10-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinsu PARK ,  Nosan PARK ,  Jae-Kwan SEO ,  Wonchun YANG ,  Kookki LEE ,  Seul-Young JEONG

IPC: H01L27/146 ,  H04N25/13

CPC classification number: H01L27/14621 ,  H01L27/14627 ,  H01L27/14645 ,  H01L27/14685 ,  H04N25/135

Abstract: A manufacturing method of an image sensor includes inputting a substrate in an equipment, wherein a sensor array and a plurality of pads are on the substrate; forming a plurality of vortex generating patterns at regular intervals between the plurality of pads and the sensor array; and coating a photo resist while rotating the substrate based on operating the equipment.

公开(公告)号：US20250098349A1

公开(公告)日：2025-03-20

申请号：US18734474

申请日：2024-06-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonchun YANG ,  Jaekwan Seo ,  Kwonseok Kim ,  Ryunhwa Lee

IPC: H01L27/146

Abstract: An image sensor may include photoelectric conversion elements within a substrate, a separation structure within the substrate and between the photoelectric conversion elements, an insulating structure on the substrate and the separation structure, a plurality of color filters on the insulating structure, a grid structure including a lower horizontal structure disposed on the insulating structure and a vertical structure connected to the lower horizontal structure and covering a side surface of one of the plurality of color filters, upper horizontal structures covering upper surfaces of the plurality of color filters, and a capping layer covering the upper horizontal structures and the grid structure. The grid structure may further include an air gap surrounded by the vertical structure, the lower horizontal structure, and the capping layer.