公开(公告)号：US20250025981A1

公开(公告)日：2025-01-23

申请号：US18647240

申请日：2024-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hojoon Lee ,  Jinuk Byun ,  Joongsuk Oh ,  Seongryeol Kim ,  Younggu Kim ,  Seunghoon Choi ,  Jaemyung Choe

IPC: B24B37/005

Abstract: The present disclosure relates to devices, methods, and systems for transforming measurement data. An example device for transforming measurement data includes a communicator configured to receive first measurement data, the first measurement data including step height values on a semiconductor chip with a chemical mechanical polishing (CMP) process performed thereon, and to receive layout data comprising a layout included in the semiconductor chip, and a processor configured to, based on the layout data, transform the first measurement data to second measurement data, the second measurement data including step height values of the semiconductor chip with a metal deposited thereon.

公开(公告)号：US20250022713A1

公开(公告)日：2025-01-16

申请号：US18633627

申请日：2024-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joongsuk Oh ,  Jinuk Byun ,  Hoyoung Kim ,  Hyunkyu Moon ,  Kiho Bae ,  Boun Yoon ,  Hojoon Lee ,  Seunghoon Choi

IPC: H01L21/304 ,  G06N3/04 ,  H01L21/66 ,  H01L21/67

Abstract: An offset data correction method includes measuring a measurement target that has undergone a chemical mechanical polishing (CMP) process, generating an offset correction model based on the measurement of the measurement target, and using the offset correction model, correcting measured data obtained from the measurement of the measurement target, wherein the offset correction model is trained by using the measured data and layout data of the measurement target as inputs.