公开(公告)号：US20240128109A1

公开(公告)日：2024-04-18

申请号：US18484562

申请日：2023-10-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Hun Kim ,  Youn Gon Oh ,  Woo-Ram Moon ,  Sang Hyuk Park ,  Jong Hun Lee ,  Kyu-Sik Jeong

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67706 ,  H01L21/67259 ,  H01L21/67715 ,  H01L21/67733 ,  H01L21/68764

Abstract: An apparatus for manufacturing a semiconductor device includes a substrate transfer unit configured to transfer a substrate, a rail unit including a driving rail extending in a first direction that the substrate transfer unit moves and a stopper on a side of the driving rail in a second direction crossing the first direction, and a lifting unit configured to move in the first direction and a third direction perpendicular to the first and second directions to remove the substrate transfer unit from the rail unit, wherein the lifting unit is configured to contact the stopper to move the stopper from a closed state to an open state.