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公开(公告)号:US20240145268A1
公开(公告)日:2024-05-02
申请号:US18468192
申请日:2023-09-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jun Woo Park , Gyu Hyeong Kim , Seung Hwan Kim , Jung Joo Kim , Jong Wan Kim , Yong Kwan Lee
CPC classification number: H01L21/67126 , H01L21/565 , H01L21/67017 , H01L21/68
Abstract: A molding apparatus for fabricating a semiconductor package includes an upper mold including an upper cavity, a first side cavity at a first side of the upper cavity, a second side cavity formed at an opposite second side of the upper cavity, and a first driving part connected to the first side cavity and configured to move the first side cavity in a first direction, and a bottom mold including a bottom cavity configured to receive a molding target including a package substrate and at least one semiconductor chip. A width in the first direction between the first side cavity and the second side cavity may be smaller than a width of the package substrate in the first direction and greater than a width in the first direction between a first boundary and a second boundary of the at least one semiconductor chip.