公开(公告)号：US20240145268A1

公开(公告)日：2024-05-02

申请号：US18468192

申请日：2023-09-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun Woo Park ,  Gyu Hyeong Kim ,  Seung Hwan Kim ,  Jung Joo Kim ,  Jong Wan Kim ,  Yong Kwan Lee

IPC: H01L21/67 ,  H01L21/56 ,  H01L21/68

CPC classification number: H01L21/67126 ,  H01L21/565 ,  H01L21/67017 ,  H01L21/68

Abstract: A molding apparatus for fabricating a semiconductor package includes an upper mold including an upper cavity, a first side cavity at a first side of the upper cavity, a second side cavity formed at an opposite second side of the upper cavity, and a first driving part connected to the first side cavity and configured to move the first side cavity in a first direction, and a bottom mold including a bottom cavity configured to receive a molding target including a package substrate and at least one semiconductor chip. A width in the first direction between the first side cavity and the second side cavity may be smaller than a width of the package substrate in the first direction and greater than a width in the first direction between a first boundary and a second boundary of the at least one semiconductor chip.