-
1.发明授权公开(公告)号：US11955359B2
公开(公告)日：2024-04-09
申请号：US17200981
申请日：2021-03-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jun Young Oh , Seung Hwan Kim , Jong Ho Park , Yong Kwan Lee , Jong Ho Lee
IPC: H01L21/673 , H01L21/67 , H01L21/02
CPC classification number: H01L21/67383 , H01L21/6732 , H01L21/67346 , H01L21/67379 , H01L21/02 , H01L21/67017
Abstract: The present disclosure provides a magazine supporting equipment for supporting a magazine with multiple input ports. The magazine supporting equipment comprises a contact plate, a first sidewall plate, and a second sidewall plate. The contact plate is in contact with the magazine. The first sidewall plate extends vertically from one end of the contact plate. The second sidewall plate parallel is to the first sidewall plate and extends vertically from one end to the other end of the contact plate. The first sidewall plate extends along at least a part of a first sidewall of the magazine. The second sidewall plate extends along at least a part of a second sidewall of the magazine. The first sidewall plate and the second sidewall plate include control openings through which gas flows in and out.
-
公开(公告)号：US20190221920A1
公开(公告)日：2019-07-18
申请号：US16359268
申请日：2019-03-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sang Bong Sung , In Jin Hwang , Seung Hwan Kim , Jae Ho Lee
Abstract: An apparatus is provided that includes an outer front side having a display disposed therein, and an outer rear side including a conductive part and a non-conductive part. The apparatus also includes a battery disposed between the outer front side and the outer rear side, a circuit board, and an antenna. The antenna includes a radiation unit capable of receiving a signal, at least a portion of the radiation unit being disposed between the outer front side and the non-conductive part of the outer rear side. The antenna also includes a feeding unit which electrically connects the radiation unit to the circuit board. The antenna further includes a ground part which electrically connects the radiation unit to the conductive part of the outer rear side. The ground part is connected to the conductive part at a connection point spaced apart from a ground point connecting the circuit board with the conductive part
-
公开(公告)号：US20210035913A1
公开(公告)日：2021-02-04
申请号：US16845890
申请日：2020-04-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： JONGHO PARK , Seung Hwan Kim , Jun Young Oh , Kyong Hwan Koh , Sangsoo Kim , Dong-Ju Jang
IPC: H01L23/538 , H01L23/31 , H01L23/16 , H01L25/065
Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.
-
公开(公告)号：US10680314B2
公开(公告)日：2020-06-09
申请号：US16359268
申请日：2019-03-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sang Bong Sung , In Jin Hwang , Seung Hwan Kim , Jae Ho Lee
Abstract: An apparatus is provided that includes an outer front side having a display disposed therein, and an outer rear side including a conductive part and a non-conductive part. The apparatus also includes a battery disposed between the outer front side and the outer rear side, a circuit board, and an antenna. The antenna includes a radiation unit capable of receiving a signal, at least a portion of the radiation unit being disposed between the outer front side and the non-conductive part of the outer rear side. The antenna also includes a feeding unit which electrically connects the radiation unit to the circuit board. The antenna further includes a ground part which electrically connects the radiation unit to the conductive part of the outer rear side. The ground part is connected to the conductive part at a connection point spaced apart from a ground point connecting the circuit board with the conductive part.
-
公开(公告)号：US20170047644A1
公开(公告)日：2017-02-16
申请号：US15337961
申请日：2016-10-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sang Bong SUNG , In Jin Hwang , Seung Hwan Kim , Jae Ho Lee
CPC classification number: H01Q1/243 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q9/0421 , H01Q9/42 , H04M1/026 , H04M1/0262
Abstract: Various mobile communication terminals, apparatuses, and methods having antenna improvements are discussed. An apparatus is described which includes an outer front side having a display disposed therein; an outer rear side a conductive part and a non-conductive part; a battery disposed between the outer front side and the outer rear side; and an antenna including a radiation unit capable of receiving a signal, at least a portion of the radiation unit being disposed between the outer front side and the non-conductive part of the outer rear side, a feeding unit which electrically connects the radiation unit to a circuit board, and a ground part which electrically connects the radiation unit to the conductive part of the outer rear side.
Abstract translation: 讨论了具有天线改进的各种移动通信终端，装置和方法。 描述了一种装置，其包括设置在其中的显示器的外前侧; 外后侧为导电部和非导电部; 设置在所述外前侧和所述外后侧之间的电池; 以及包括能够接收信号的辐射单元的天线，所述辐射单元的至少一部分设置在所述外后侧的外前侧和非导电部之间，馈电单元将所述辐射单元电连接到 电路板和将辐射单元电连接到外后侧的导电部的接地部。
-
Patent Agency Ranking
公开(公告)号：US09054419B2
公开(公告)日：2015-06-09
申请号：US13962483
申请日：2013-08-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sang Bong Sung , In Jin Hwang , Seung Hwan Kim , Jae Ho Lee
CPC classification number: H01Q1/243 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q9/0421 , H01Q9/42 , H04M1/026 , H04M1/0262
Abstract: An antenna device of a mobile terminal that can secure radiation performance is provided. The antenna device having a battery cover composed of a metal material includes a radiation unit for transmitting and receiving a signal, a feeding unit formed at an end portion of a first side of the radiation unit for electrically connecting the radiation unit to a Printed Circuit Board (PCB), and a ground part disposed a predetermined distance from the feeding unit and formed at a second side of the radiation unit. When the battery cover is fastened to the mobile terminal, the ground part contacts a first side of the battery cover.
Abstract translation: 提供了可以确保辐射性能的移动终端的天线装置。 具有由金属材料构成的电池盖的天线装置包括用于发送和接收信号的辐射单元，形成在辐射单元的第一侧的端部处的馈电单元，用于将辐射单元电连接到印刷电路板 （PCB），以及配置在距离供电单元预定距离并形成在辐射单元的第二侧的接地部分。 当电池盖固定到移动终端时，接地部分接触电池盖的第一侧。
-
公开(公告)号：US11996365B2
公开(公告)日：2024-05-28
申请号：US18114358
申请日：2023-02-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jongho Park , Seung Hwan Kim , Jun Young Oh , Kyong Hwan Koh , Sangsoo Kim , Dong-Ju Jang
IPC: H01L23/538 , H01L23/16 , H01L23/31 , H01L25/065
CPC classification number: H01L23/5384 , H01L23/16 , H01L23/31 , H01L23/5385 , H01L25/0652
Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.
-
公开(公告)号：US11538801B2
公开(公告)日：2022-12-27
申请号：US17220468
申请日：2021-04-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jongho Park , Seung Hwan Kim , Jun Young Oh , Jungjoo Kim , Yongkwan Lee , Dong-Ju Jang
IPC: H01L25/18 , H01L23/538 , H01L25/00 , H01L23/00
Abstract: A semiconductor package includes a first substrate that includes a first trench on a recessed portion of a bottom surface of the first substrate and a first through hole extending through the first substrate to the first trench, a first semiconductor chip on the first substrate, a first capacitor chip in the first trench and on the first substrate, and a first molding layer on the first substrate and covering the first semiconductor chip. The first molding layer includes a first part that extends parallel to a top surface of the first substrate, a second part connected to the first part and extending vertically in the first through hole, and a third part connected to the second part and surrounding the first capacitor chip. A bottom surface of the third part is coplanar with the bottom surface of the first substrate.
-
公开(公告)号：US20130221485A1
公开(公告)日：2013-08-29
申请号：US13734322
申请日：2013-01-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： YONGHOON KIM , Seung Hwan Kim , Heeseok Lee
IPC: H05K1/18
CPC classification number: H05K1/185 , H01L28/40 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/19105 , H05K3/4608 , H05K2201/0979 , H05K2201/10015
Abstract: A wiring board includes a metal core including a first surface and a second surface facing each other and a first portion and a second portion disposed on the first and second surfaces, respectively. The first and second portions each include a plurality of insulating layers and a plurality of wiring layers stacked in an alternating manner. At least one capacitor is disposed in at least one interior region. The at least one capacitor includes first and second electrodes. The at least one interior region exposes a portion of the metal core and a portion of at least one of the first and second portions adjacent to the metal core and at least one first via electrically connects one of the wiring layers of the first portion with the first and second electrodes.
Abstract translation: 布线板包括金属芯，该金属芯包括彼此面对的第一表面和第二表面，以及分别设置在第一表面和第二表面上的第一部分和第二部分。 第一和第二部分各自包括交替堆叠的多个绝缘层和多个布线层。 至少一个电容器设置在至少一个内部区域中。 所述至少一个电容器包括第一和第二电极。 所述至少一个内部区域暴露所述金属芯的一部分，并且所述第一和第二部分中的至少一个的一部分与所述金属芯相邻，并且至少一个第一通孔将所述第一部分的所述布线层中的一个与 第一和第二电极。
-
10.发明公开公开(公告)号：US20240145268A1
公开(公告)日：2024-05-02
申请号：US18468192
申请日：2023-09-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jun Woo Park , Gyu Hyeong Kim , Seung Hwan Kim , Jung Joo Kim , Jong Wan Kim , Yong Kwan Lee
CPC classification number: H01L21/67126 , H01L21/565 , H01L21/67017 , H01L21/68
Abstract: A molding apparatus for fabricating a semiconductor package includes an upper mold including an upper cavity, a first side cavity at a first side of the upper cavity, a second side cavity formed at an opposite second side of the upper cavity, and a first driving part connected to the first side cavity and configured to move the first side cavity in a first direction, and a bottom mold including a bottom cavity configured to receive a molding target including a package substrate and at least one semiconductor chip. A width in the first direction between the first side cavity and the second side cavity may be smaller than a width of the package substrate in the first direction and greater than a width in the first direction between a first boundary and a second boundary of the at least one semiconductor chip.
-
-
-
-
-
-
-
-
-
Search Results
20
records
(took 0.025 seconds)
