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1.发明申请THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE MADE THEREFROM, AND METHOD OF PREPARING THE THERMOPLASTIC RESIN COMPOSITION 审中-公开热塑性树脂组合物，其制造的制品及其制备热塑性树脂组合物的方法公开(公告)号：US20160122532A1
公开(公告)日：2016-05-05
申请号：US14933926
申请日：2015-11-05
Inventor： Chansu Kim , Jongchan Lee , Minyoung Lim , Namsoo Park , Kwangmyung Cho
CPC classification number: C08L67/04 , C08J3/226 , C08J2367/04 , C08J2467/04 , C08K3/042
Abstract: A thermoplastic resin composition, a molded article made therefrom, and a method of preparing the thermoplastic resin composition are provided. The thermoplastic resin composition includes: a first thermoplastic polymer; and an organic-inorganic composite including a carbonaceous core and a second thermoplastic polymer grafted onto the carbonaceous core, wherein a structural unit of the first thermoplastic polymer and a structural unit of the second thermoplastic polymer are stereoisomers or have different structures.
Abstract translation: 提供热塑性树脂组合物，由其制成的模塑制品和制备热塑性树脂组合物的方法。 热塑性树脂组合物包括：第一热塑性聚合物; 以及包含碳质核和接枝到碳质芯上的第二热塑性聚合物的有机 - 无机复合物，其中第一热塑性聚合物的结构单元和第二热塑性聚合物的结构单元是立体异构体或具有不同的结构。
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公开(公告)号：US20240376604A1
公开(公告)日：2024-11-14
申请号：US18660546
申请日：2024-05-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjoong Kim , Jongchan Lee , Junho Lee , Jinman Park , Sengyeop Kim , Youngjoo Kim , Seounghwan Byun , Hana Seu , Sunjoo Lee , Cheoljae Lee , Dongchul Choi
Abstract: A substrate processing apparatus includes a processing chamber including a processing space where a substrate is processed and a heater provided in the process chamber to support the substrate and configured to heat the substrate, wherein the heater includes a body, a first protrusion portion protruding upward in a vertical direction from a center of the body, and a second protrusion portion protruding upward from a center of the first protrusion portion, first embossings are formed in a region which does not overlap the first protrusion portion in a vertical direction on an upper surface of the body, second embossings are formed in a region which does not overlap the second protrusion portion in a vertical direction on an upper surface of the first protrusion portion, and third embossings are formed on an upper surface of the second protrusion portion.
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3.发明申请POLYLACTIC ACID PREPARATION METHOD, POLYLACTIC ACID RESIN PREPARED USING THE METHOD, RESIN COMPOSITION COMPRISING THE POLYLACTIC ACID RESIN, AND CATALYST SYSTEM FOR PREPARING POLYLACTIC ACID 有权聚酸制备方法，使用该方法制备的聚酯酸树脂，包含聚酸树脂的树脂组合物和用于制备聚酸的催化剂体系公开(公告)号：US20150225501A1
公开(公告)日：2015-08-13
申请号：US14507514
申请日：2014-10-06
Applicant: Samsung Electronics Co., Ltd. , SNU R&DB Foundation
Inventor： Younghoon Lee , Chansu Kim , Hail Kwon , Changduk Kang , Jongchan Lee , Kwangmyung Cho , Sangho Cha , Hyunkee Hong
IPC: C08G63/82
CPC classification number: C08G63/823
Abstract: A method of preparing polylactic acid by combining lactide with a main catalyst and cocatalyst, wherein the main catalyst includes an organometallic compound and a cocatalyst includes a nanoparticle; as well as a composition are provided.
Abstract translation: 通过将丙交酯与主催化剂和助催化剂组合制备聚乳酸的方法，其中主催化剂包括有机金属化合物和助催化剂，包括纳米颗粒; 以及组合物。
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4.发明授权Polylactic acid preparation method, polylactic acid resin prepared using the method, resin composition comprising the polylactic acid resin, and catalyst system for preparing polylactic acid 有权聚乳酸制备方法，使用该方法制备的聚乳酸树脂，包含聚乳酸树脂的树脂组合物和用于制备聚乳酸的催化剂体系公开(公告)号：US09234075B2
公开(公告)日：2016-01-12
申请号：US14507514
申请日：2014-10-06
Applicant: Samsung Electronics Co., Ltd. , SNU R&DB Foundation
Inventor： Younghoon Lee , Chansu Kim , Hail Kwon , Changduk Kang , Jongchan Lee , Kwangmyung Cho , Sangho Cha , Hyunkee Hong
CPC classification number: C08G63/823
Abstract: A method of preparing polylactic acid by combining lactide with a main catalyst and cocatalyst, wherein the main catalyst includes an organometallic compound and a cocatalyst includes a nanoparticle; as well as a composition are provided.
Abstract translation: 通过将丙交酯与主催化剂和助催化剂组合制备聚乳酸的方法，其中主催化剂包括有机金属化合物和助催化剂，包括纳米颗粒; 以及组合物。
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