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公开(公告)号：US09620844B2
公开(公告)日：2017-04-11
申请号：US14210013
申请日：2014-03-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjoong Kim , Youngmin Kang , Jaewoo Lee , Jongsik Kim , Kwangsoo Han , Juho Yi
CPC classification number: H01Q1/12 , H01Q1/243 , H04M1/0274 , H05K5/0247 , Y10T29/49208 , Y10T403/591 , Y10T403/70
Abstract: A connector joint support module includes a boss including at least one projection; a connector joint disposed in an area adjacent to the boss, and a bracket disposed to be engaged with the boss while covering at least a portion of the connector joint. An electronic device includes a boss including at least one projection, a connector joint disposed in an area adjacent to the boss, a bracket disposed to be engaged with the boss and to cover at least a portion of the connector joint, a screw recess formed in a female screw shape at a center of the projection of the boss, an antenna carrier or a rear frame disposed to enclose the bracket, and a screw passing through one side of the antenna carrier or the rear frame and engaged with the screw recess of the boss.
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公开(公告)号：US20240086599A1
公开(公告)日：2024-03-14
申请号：US18509654
申请日：2023-11-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjoong Kim , Jaepil Shin , Moonhyun Cha , Changwook Jeong
CPC classification number: G06F30/27 , G06N3/045 , G06N3/08 , G06F2119/02
Abstract: A system for modeling a semiconductor fabrication process includes at least one first processor and at least one second processor. The at least one first processor is configured to provide at least one machine learning (ML) model, which is trained by using a plurality of pairs of images of a design pattern sample and a physical pattern sample. The physical pattern sample is formed from the design pattern sample by using the semiconductor fabrication process. The at least one second processor is configured to provide an input image representing a shape of a design pattern and/or a physical pattern to the at least one first processor and to generate output data defining the physical pattern and/or the design pattern based on an output image received from the at least one first processor.
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公开(公告)号：US11232029B2
公开(公告)日：2022-01-25
申请号：US17003346
申请日：2020-08-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joonsik Sohn , Hyunjoong Kim , Woongjae Song , Soowoong Ahn , Seunghyun Cho , Jihyun Choi
IPC: G11C8/00 , G06F12/06 , H01L23/48 , H01L25/065
Abstract: According to some example embodiments of the inventive concepts, there is provided a method of operating a stacked memory device including a plurality of memory dies stacked in a vertical direction, the method including receiving a command and an address from a memory controller, determining a stack ID indicating a subset of the plurality of memory dies by decoding the address, and accessing at least two memory dies among the subset of memory dies corresponding to the stack ID such that the at least two memory dies are non-adjacent.
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公开(公告)号：US20180268383A1
公开(公告)日：2018-09-20
申请号：US15901232
申请日：2018-02-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Younghoon Kim , Hyunjoong Kim , Sang Chul Baek , Dong-Ho Jang
CPC classification number: G06Q20/085 , G06F16/9535 , G06F16/986 , G06Q20/12 , G06Q20/3255
Abstract: An electronic device according to various example embodiments includes: a memory storing instructions; a wireless communication circuit; and at least one processor, electrically coupled to the memory and the wireless communication circuit, configured to execute the stored instructions to: receive, from a first external electronic device, a first message for indicating that a first transaction is completed; determine at least one web address including a domain name associated with the transaction, among a plurality of web addresses accessed, by the electronic device, during an interval determined based on a timing at which the first message is received; determine information regarding an item of the first transaction by parsing data regarding at least one web document associated with the at least one web address; and transmit, to the first external electronic device or a second external electronic device, information regarding the item of the first transaction.
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公开(公告)号：US11599458B2
公开(公告)日：2023-03-07
申请号：US17551707
申请日：2021-12-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joonsik Sohn , Hyunjoong Kim , Woongjae Song , Soowoong Ahn , Seunghyun Cho , Jihyun Choi
IPC: G11C8/00 , G06F12/06 , H01L23/48 , H01L25/065
Abstract: According to some example embodiments of the inventive concepts, there is provided a method of operating a stacked memory device including a plurality of memory dies stacked in a vertical direction, the method including receiving a command and an address from a memory controller, determining a stack ID indicating a subset of the plurality of memory dies by decoding the address, and accessing at least two memory dies among the subset of memory dies corresponding to the stack ID such that the at least two memory dies are non-adjacent.
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Patent Agency Ranking
公开(公告)号：US20240376604A1
公开(公告)日：2024-11-14
申请号：US18660546
申请日：2024-05-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjoong Kim , Jongchan Lee , Junho Lee , Jinman Park , Sengyeop Kim , Youngjoo Kim , Seounghwan Byun , Hana Seu , Sunjoo Lee , Cheoljae Lee , Dongchul Choi
Abstract: A substrate processing apparatus includes a processing chamber including a processing space where a substrate is processed and a heater provided in the process chamber to support the substrate and configured to heat the substrate, wherein the heater includes a body, a first protrusion portion protruding upward in a vertical direction from a center of the body, and a second protrusion portion protruding upward from a center of the first protrusion portion, first embossings are formed in a region which does not overlap the first protrusion portion in a vertical direction on an upper surface of the body, second embossings are formed in a region which does not overlap the second protrusion portion in a vertical direction on an upper surface of the first protrusion portion, and third embossings are formed on an upper surface of the second protrusion portion.
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公开(公告)号：US11853660B2
公开(公告)日：2023-12-26
申请号：US17231428
申请日：2021-04-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjoong Kim , Jaepil Shin , Moonhyun Cha , Changwook Jeong
IPC: H01L21/027 , G06F30/39 , G06F30/27 , G06N3/08 , G06N3/045 , G06F119/02 , G06F119/18
CPC classification number: G06F30/27 , G06N3/045 , G06N3/08 , G06F2119/02 , G06F2119/18
Abstract: A system for modeling a semiconductor fabrication process includes at least one first processor and at least one second processor. The at least one first processor is configured to provide at least one machine learning (ML) model, which is trained by using a plurality of pairs of images of a design pattern sample and a physical pattern sample. The physical pattern sample is formed from the design pattern sample by using the semiconductor fabrication process. The at least one second processor is configured to provide an input image representing a shape of a design pattern and/or a physical pattern to the at least one first processor and to generate output data defining the physical pattern and/or the design pattern based on an output image received from the at least one first processor.
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公开(公告)号：US20210133028A1
公开(公告)日：2021-05-06
申请号：US16878793
申请日：2020-05-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjoong Kim , Taekwoon Kim , Younghoe Kim , Wonhyung Song , Jangseok Choi , Joonseok Choi
IPC: G06F11/10
Abstract: A memory controller configured to control a memory module including a plurality of memory devices which constitute a first channel and a second channel includes an error correction code (ECC) engine, and a control circuit configured to control the ECC engine. The ECC engine is configured to generate a codeword including a plurality of symbols by adaptively constructing, based on device information including mapping information, each of the plurality of symbols from a predetermined number of data bits received via a plurality of input/output pads of each of the plurality of memory devices, and transmit the codeword to the memory module. The mapping information indicates whether each of the plurality of input/output pads is mapped to the same symbol among the plurality of symbols or different symbols among the plurality of symbols. Each of the plurality of symbols corresponds to a unit of error correction of the ECC engine.
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9.发明申请CONNECTOR JOINT SUPPORT MODULE, ELECTRONIC DEVICE INCLUDING THE SAME, AND METHODS OF ASSEMBLING AND DISASSEMBLING ELECTRONIC DEVICE 有权连接器支持模块，包括其的电子设备以及组装和拆卸电子设备的方法公开(公告)号：US20140273632A1
公开(公告)日：2014-09-18
申请号：US14210013
申请日：2014-03-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunjoong Kim , Youngmin Kang , Jaewoo Lee , Jongsik Kim , Kwangsoo Han , Juho Yi
CPC classification number: H01Q1/12 , H01Q1/243 , H04M1/0274 , H05K5/0247 , Y10T29/49208 , Y10T403/591 , Y10T403/70
Abstract: A connector joint support module includes a boss including at least one projection; a connector joint disposed in an area adjacent to the boss, and a bracket disposed to be engaged with the boss while covering at least a portion of the connector joint. An electronic device includes a boss including at least one projection, a connector joint disposed in an area adjacent to the boss, a bracket disposed to be engaged with the boss and to cover at least a portion of the connector joint, a screw recess formed in a female screw shape at a center of the projection of the boss, an antenna carrier or a rear frame disposed to enclose the bracket, and a screw passing through one side of the antenna carrier or the rear frame and engaged with the screw recess of the boss.
Abstract translation: 连接器接头支撑模块包括：凸台，其包括至少一个突出部; 设置在与所述凸台相邻的区域中的连接器接头，以及设置成与所述凸台接合并覆盖所述连接器接头的至少一部分的托架。 一种电子设备，包括：凸台，其包括至少一个突出部，设置在与所述凸台相邻的区域中的连接器接头;布置成与所述凸台接合并覆盖所述连接器接头的至少一部分的托架; 在凸起的突起的中心处的阴螺纹形状，设置成围绕支架的天线托架或后框架，以及穿过天线托架或后框架的一侧的螺钉，并与螺钉凹部接合 老板。
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公开(公告)号：US12254241B2
公开(公告)日：2025-03-18
申请号：US18088211
申请日：2022-12-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jungwon Moon , Seonghwan Kim , Jongwook Lim , Misun Kim , Byeongnam Kim , Hyunjoong Kim
Abstract: An electronic device may include an audio output device; and a processor configured to be operatively connected to the audio output device. The processor is configured to: acquire a first user input for reproducing a first audio related to a first application; based on the first user input, generate first decoded data by decoding the first audio using a first codec; generate first synthesized data by applying a first audio effect to the first decoded data; transmit the first synthesized data to an audio framework; based on the first audio being decoded using the first codec, transmit, to the audio framework, a first request for deactivating a function of applying a second audio effect; and output the first synthesized data via the audio output device without applying the second audio effect to the first synthesized data, based on the function of applying the second audio effect being deactivated.
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