公开(公告)号：US20240376604A1

公开(公告)日：2024-11-14

申请号：US18660546

申请日：2024-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjoong Kim ,  Jongchan Lee ,  Junho Lee ,  Jinman Park ,  Sengyeop Kim ,  Youngjoo Kim ,  Seounghwan Byun ,  Hana Seu ,  Sunjoo Lee ,  Cheoljae Lee ,  Dongchul Choi

IPC: C23C16/46 ,  H01J37/32

Abstract: A substrate processing apparatus includes a processing chamber including a processing space where a substrate is processed and a heater provided in the process chamber to support the substrate and configured to heat the substrate, wherein the heater includes a body, a first protrusion portion protruding upward in a vertical direction from a center of the body, and a second protrusion portion protruding upward from a center of the first protrusion portion, first embossings are formed in a region which does not overlap the first protrusion portion in a vertical direction on an upper surface of the body, second embossings are formed in a region which does not overlap the second protrusion portion in a vertical direction on an upper surface of the first protrusion portion, and third embossings are formed on an upper surface of the second protrusion portion.