公开(公告)号：US20250070022A1

公开(公告)日：2025-02-27

申请号：US18634325

申请日：2024-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongkyun LEE ,  Hyejin KIM ,  Yonghyeok SON ,  Jichang SIM ,  Joo-Sung LEE ,  Yujin CHO

IPC: H01L23/528 ,  H01L23/522 ,  H10B12/00

Abstract: A semiconductor device may include a substrate including a cell array region, a core region, and a peripheral circuit region, a core circuit wiring on the core region of the substrate, a core signal wiring overlapping the core circuit wiring, and a contact plug between the core circuit wiring and the core signal wiring. The contact plug may connect the core circuit wiring to the core signal wiring. A positional relationship between the core signal wiring and the contact plug may be different depending on distance from the peripheral circuit region.