公开(公告)号：US20240304476A1

公开(公告)日：2024-09-12

申请号：US18368116

申请日：2023-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： TAEMIN LEE ,  Dongsoo Lee ,  Jooyoung Yoon ,  Sangsoon Lim ,  Anhi Pyun

IPC: H01L21/67 ,  G01P1/07 ,  G01P3/00 ,  G01P15/14 ,  G01P15/18 ,  H01L21/677

CPC classification number: H01L21/67265 ,  G01P1/07 ,  G01P3/00 ,  G01P15/14 ,  G01P15/18 ,  H01L21/6773

Abstract: A semiconductor post-process impact detection device includes a detection body that moves along a distribution line. A vibration detection unit is coupled to the detection body. The vibration detection unit detects vibration of the detection body. A rotation detection unit is coupled to the detection body. The rotation detection unit detects rotation of the detection body. An internal power supply is coupled to the detection body. A controller processes signals of the vibration detection unit and the rotation detection unit to determine information concerning the detection body. The controller transmits the information concerning the detection body to a data transmission unit. The data transmission unit transmits the information concerning the detection body provided from the controller to a data display unit. The data display unit displays the information concerning the detection body provided from the data transmission unit.