公开(公告)号：US20240304476A1

公开(公告)日：2024-09-12

申请号：US18368116

申请日：2023-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： TAEMIN LEE ,  Dongsoo Lee ,  Jooyoung Yoon ,  Sangsoon Lim ,  Anhi Pyun

IPC: H01L21/67 ,  G01P1/07 ,  G01P3/00 ,  G01P15/14 ,  G01P15/18 ,  H01L21/677

CPC classification number: H01L21/67265 ,  G01P1/07 ,  G01P3/00 ,  G01P15/14 ,  G01P15/18 ,  H01L21/6773

Abstract: A semiconductor post-process impact detection device includes a detection body that moves along a distribution line. A vibration detection unit is coupled to the detection body. The vibration detection unit detects vibration of the detection body. A rotation detection unit is coupled to the detection body. The rotation detection unit detects rotation of the detection body. An internal power supply is coupled to the detection body. A controller processes signals of the vibration detection unit and the rotation detection unit to determine information concerning the detection body. The controller transmits the information concerning the detection body to a data transmission unit. The data transmission unit transmits the information concerning the detection body provided from the controller to a data display unit. The data display unit displays the information concerning the detection body provided from the data transmission unit.

公开(公告)号：US11721568B2

公开(公告)日：2023-08-08

申请号：US16996116

申请日：2020-08-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangho Jang ,  Dongsoo Lee ,  Anhi Pyun ,  Jinyi Lee ,  Sukbyung Chae

IPC: B65G47/52 ,  B65G15/14 ,  B65G27/16 ,  B65G39/18 ,  H01L21/67 ,  B65G41/00 ,  H01L21/677

CPC classification number: H01L21/67259 ,  B65G15/14 ,  B65G27/16 ,  B65G39/18 ,  B65G41/002 ,  B65G47/52 ,  H01L21/67288 ,  H01L21/67706 ,  H01L21/67718 ,  B65G2203/0208 ,  B65G2203/042 ,  B65G2203/044

Abstract: The present disclosure relates to a substrate transfer apparatus. The substrate transfer apparatus includes a first transfer apparatus, a second transfer apparatus, a substrate carrier driver, a sensor, a swing apparatus, and a controller. The first transfer apparatus is configured to transfer a substrate in a first direction. The second transfer apparatus is configured to receive the substrate from the first transfer apparatus and transfer the substrate and comprising a substrate carrier on which the substrate transferred from the first transfer apparatus is seated. The substrate carrier driver is configured to move the substrate carrier. The sensor is configured to detect an abnormal transfer of the substrate from the first transfer apparatus to the second transfer apparatus and generate a detection signal corresponding to the abnormal transfer of the substrate. The swing apparatus is configured to swing the substrate carrier. The controller is connected to the sensor and the swing apparatus and configured to control the swing apparatus based on the detection signal of the sensor.

公开(公告)号：US20210193491A1

公开(公告)日：2021-06-24

申请号：US16996116

申请日：2020-08-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SANGHO JANG ,  Dongsoo Lee ,  Anhi Pyun ,  Jinyi Lee ,  Sukbyung Chae

IPC: H01L21/67 ,  B65G41/00 ,  B65G47/52 ,  B65G15/14 ,  B65G27/16 ,  B65G39/18 ,  H01L21/677

Abstract: The present disclosure relates to a substrate transfer apparatus. The substrate transfer apparatus includes a first transfer apparatus, a second transfer apparatus, a substrate carrier driver, a sensor, a swing apparatus, and a controller. The first transfer apparatus is configured to transfer a substrate in a first direction. The second transfer apparatus is configured to receive the substrate from the first transfer apparatus and transfer the substrate and comprising a substrate carrier on which the substrate transferred from the first transfer apparatus is seated. The substrate carrier driver is configured to move the substrate carrier. The sensor is configured to detect an abnormal transfer of the substrate from the first transfer apparatus to the second transfer apparatus and generate a detection signal corresponding to the abnormal transfer of the substrate. The swing apparatus is configured to swing the substrate carrier. The controller is connected to the sensor and the swing apparatus and configured to control the swing apparatus based on the detection signal of the sensor.