公开(公告)号：US20170051424A1

公开(公告)日：2017-02-23

申请号：US15234687

申请日：2016-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Atsushi Fujisaki ,  Ju-II Choi ,  Kun-Sang Park ,  Byung-Lyul Park ,  Ji-Soon Park

IPC: C25D5/02 ,  C25D21/12

CPC classification number: C25D21/12 ,  C25D17/008

Abstract: A shielding unit for a plating apparatus may include a shielding plate, a controlling plate and a rotary actuator. The shielding plate may have a plurality of holes configured to permit a passage of an electrolyte therethrough. The controlling plate may make contact with the shielding plate. The controlling plate may have a plurality of controlling holes for controlling an opening ratio of the plurality of holes of the shielding plate. The rotary actuator may rotate the controlling plate to control the opening ratio of the plurality of holes shielding plate.

Abstract translation: 电镀装置的屏蔽单元可以包括屏蔽板，控制板和旋转致动器。 屏蔽板可以具有多个构造成允许电解液通过其中的孔。 控制板可以与屏蔽板接触。 控制板可以具有用于控制屏蔽板的多个孔的开口率的多个控制孔。 旋转致动器可旋转控制板以控制多个孔屏蔽板的开口率。