公开(公告)号：US10917734B2

公开(公告)日：2021-02-09

申请号：US15845320

申请日：2017-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Soon Park

IPC: H04S7/00 ,  G06F3/0484 ,  H04R3/12 ,  G06F3/0481

Abstract: An electronic device for controlling a speaker and an operating method thereof are provided. The electronic device includes an audio output apparatus, and a processor configured to, according to a type of a first sound source to be output through the audio output apparatus, control an output of the audio output apparatus to output a first sound corresponding to the first sound source so as to be focused on a first area.

公开(公告)号：US20170051424A1

公开(公告)日：2017-02-23

申请号：US15234687

申请日：2016-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Atsushi Fujisaki ,  Ju-II Choi ,  Kun-Sang Park ,  Byung-Lyul Park ,  Ji-Soon Park

IPC: C25D5/02 ,  C25D21/12

CPC classification number: C25D21/12 ,  C25D17/008

Abstract: A shielding unit for a plating apparatus may include a shielding plate, a controlling plate and a rotary actuator. The shielding plate may have a plurality of holes configured to permit a passage of an electrolyte therethrough. The controlling plate may make contact with the shielding plate. The controlling plate may have a plurality of controlling holes for controlling an opening ratio of the plurality of holes of the shielding plate. The rotary actuator may rotate the controlling plate to control the opening ratio of the plurality of holes shielding plate.

Abstract translation: 电镀装置的屏蔽单元可以包括屏蔽板，控制板和旋转致动器。 屏蔽板可以具有多个构造成允许电解液通过其中的孔。 控制板可以与屏蔽板接触。 控制板可以具有用于控制屏蔽板的多个孔的开口率的多个控制孔。 旋转致动器可旋转控制板以控制多个孔屏蔽板的开口率。

公开(公告)号：US09431341B2

公开(公告)日：2016-08-30

申请号：US14329749

申请日：2014-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yi-Koan Hong ,  Byung-Lyul Park ,  Ji-Soon Park ,  Si-Young Choi

IPC: H01L29/40 ,  H01L23/528 ,  H01L23/48 ,  H01L25/065

CPC classification number: H01L23/528 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/08146 ,  H01L2224/80894 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2224/80001 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Provided is a semiconductor device. The semiconductor device includes a passivation layer defining a metal pattern on a first surface of a substrate, an inter-layer insulating layer disposed on a second surface of the substrate, and a piezoelectric pattern formed between the metal pattern and the passivation layer on the first surface of the substrate. A through-silicon-via and/or a pad can be directly bonded to another through-silicon-via and/or another pad by applying pressure only, and without performing a heat process.

Abstract translation: 提供一种半导体器件。 半导体器件包括在衬底的第一表面上限定金属图案的钝化层，设置在衬底的第二表面上的层间绝缘层，以及形成在金属图案和第一钝化层之间的压电图案 基板的表面。 通过硅通孔和/或焊盘可以仅通过施加压力而不进行热处理直接结合到另一个通硅通孔和/或另一焊盘。

公开(公告)号：US20180176707A1

公开(公告)日：2018-06-21

申请号：US15845320

申请日：2017-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Soon Park

IPC: H04S7/00 ,  G06F3/0484 ,  G06F3/0481 ,  H04R3/12

CPC classification number: H04S7/30 ,  G06F3/0481 ,  G06F3/0484 ,  H04R3/12 ,  H04R2499/13 ,  H04S7/303

Abstract: An electronic device for controlling a speaker and an operating method thereof are provided. The electronic device includes an audio output apparatus, and a processor configured to, according to a type of a first sound source to be output through the audio output apparatus, control an output of the audio output apparatus to output a first sound corresponding to the first sound source so as to be focused on a first area.

公开(公告)号：US09691685B2

公开(公告)日：2017-06-27

申请号：US15163995

申请日：2016-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyu-Ha Lee ,  Hyung-Jun Jeon ,  Jum-Yong Park ,  Byung-Lyul Park ,  Ji-Soon Park ,  Jin-Ho An ,  Jin-Ho Chun

IPC: H01L23/544 ,  H01L23/48 ,  H01L23/00 ,  H01L23/532 ,  H01L21/768 ,  H01L21/78

CPC classification number: H01L23/481 ,  H01L21/76852 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/291 ,  H01L23/293 ,  H01L23/31 ,  H01L23/3192 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/544 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L2223/5446 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/06151 ,  H01L2224/06156 ,  H01L2224/06181 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/014

Abstract: A semiconductor device includes a substrate having a die region and a scribe region surrounding the die region, a plurality of via structures penetrating through the substrate in the die region, a portion of the via structure being exposed over a surface of the substrate, and a protection layer pattern structure provided on the surface of the substrate surrounding a sidewall of the exposed portion of the via structure and having a protruding portion covering at least a portion of the scribe region adjacent to the via structure.

公开(公告)号：US20160163590A1

公开(公告)日：2016-06-09

申请号：US14956869

申请日：2015-12-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Deokyoung Jung ,  Seong-Min Son ,  Jin-Ho An ,  Byung-Lyul Park ,  Ji-Soon Park ,  Ho-Jin Lee

IPC: H01L21/768

CPC classification number: H01L21/76898 ,  H01L21/6835 ,  H01L24/03 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/03002 ,  H01L2224/034 ,  H01L2224/0557 ,  H01L2224/11002 ,  H01L2224/114 ,  H01L2224/13025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: Disclosed is a method of manufacturing a semiconductor device. A preliminary wafer-carrier assembly is formed in such a way that a wafer structure having a plurality of via structures is adhered to a light-penetrating carrier by a photodegradable adhesive. A wafer-carrier assembly having an optical shielding layer for inhibiting or preventing a light penetration is formed such that the wafer structure, the carrier and the adhesive are covered with the optical shielding layer except for the backside of the wafer structure through which the via structures are exposed. An interconnector is formed on the backside of the wafer structure such that the via structures make contact with the interconnector, and the wafer structure and the carrier are separated from each other by irradiating a light to the wafer-carrier assembly. Accordingly, the adhesive is inhibited or prevented from being dissolved during a plasma process on the wafer-carrier assembly.

Abstract translation: 公开了半导体器件的制造方法。 初步的晶片载体组件形成为具有多个通路结构的晶片结构通过可光降解的粘合剂粘附到透光载体上。 形成具有用于抑制或防止光穿透的光学屏蔽层的晶片载体组件，使得晶片结构，载体和粘合剂被除了晶片结构的背面之外的光学屏蔽层覆盖，通过该晶片结构， 被暴露。 在晶片结构的背面形成互连器，使得通孔结构与互连器接触，并且通过向晶片载体组件照射光而使晶片结构和载体彼此分离。 因此，在晶片载体组件的等离子体处理中，粘合剂被抑制或防止溶解。

公开(公告)号：US20170033032A1

公开(公告)日：2017-02-02

申请号：US15163995

申请日：2016-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyu-Ha Lee ,  Hyung-Jun Jeon ,  Jum-Yong Park ,  Byung-Lyul Park ,  Ji-Soon Park ,  Jin-Ho An ,  Jin-Ho Chun

IPC: H01L23/48 ,  H01L21/78 ,  H01L23/532 ,  H01L21/768 ,  H01L23/544 ,  H01L23/00

CPC classification number: H01L23/481 ,  H01L21/76852 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/291 ,  H01L23/293 ,  H01L23/31 ,  H01L23/3192 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/544 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L2223/5446 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/06151 ,  H01L2224/06156 ,  H01L2224/06181 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/014

Abstract: A semiconductor device includes a substrate having a die region and a scribe region surrounding the die region, a plurality of via structures penetrating through the substrate in the die region, a portion of the via structure being exposed over a surface of the substrate, and a protection layer pattern structure provided on the surface of the substrate surrounding a sidewall of the exposed portion of the via structure and having a protruding portion covering at least a portion of the scribe region adjacent to the via structure.

Abstract translation: 半导体器件包括具有管芯区域和围绕管芯区域的划线区域的衬底，穿过管芯区域中的衬底的多个通孔结构，一部分通孔结构暴露在衬底的表面上，以及 保护层图案结构，其设置在所述基板的表面上，所述表面包围所述通孔结构的所述暴露部分的侧壁，并且具有覆盖所述划线区域的与所述通孔结构相邻的至少一部分的突出部分。